Datasheet

Table Of Contents
PIC12(L)F1822/PIC16(L)F1823
DS40001413E-page 420 2010-2015 Microchip Technology Inc.
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
X /XX XXX
PatternPackageTemperature
Range
Device
Device: PIC12F1822, PIC12LF1822
PIC16F1823, PIC16LF1823
Tape and Reel
Option:
Blank = standard packaging (tube or tray)
T = Tape and Reel
(1)
Temperature
Range:
I= -40C to +85C (Industrial)
E= -40C to +125C (Extended)
Package:
(2)
JQ = Micro Lead Frame (UQFN) 4x4x0.5mm
MF = Micro Lead Frame (DFN) 3x3x0.9mm
ML = Micro Lead Frame (QFN) 4x4x0.9mm
P = Plastic DIP
RF = Micro Lead Frame (UDFN) 3x3x0.5mm
SL = SOIC
SN = SOIC
ST = TSSOP
Pattern: QTP, SQTP, Code or Special Requirements
(blank otherwise)
Examples:
a) PIC12F1822 - I/MF 301 = Industrial temp., DFN
package, QTP pattern #301.
b) PIC16F1823 - I/P = Industrial temp., PDIP
package.
c) PIC16F1823 - E/ST= Extended temp., TSSOP
package.
Note 1: Tape and Reel identifier only appears in the
catalog part number description. This
identifier is used for ordering purposes and
is not printed on the device package. Check
with your Microchip Sales Office for package
availability with the Tape and Reel option.
2: Small-form factor packaging options may be
available. Please check
www.microchip.com/packaging for small
form-factor package availability, or contact
your local Sales Office.
[X]
Tape and Reel
Option
-