Datasheet
2011-2015 Microchip Technology Inc. DS40001615C-page 219
PIC12(L)F1501
TABLE 27-6: THERMAL CONSIDERATIONS
TABLE 27-5: MEMORY PROGRAMMING SPECIFICATIONS
Standard Operating Conditions (unless otherwise stated)
Param.
No.
Sym. Characteristic Min. Typ† Max. Units Conditions
Program Memory
Programming Specifications
D110
V
IHH Voltage on MCLR/VPP pin 8.0 — 9.0 V (Note 2)
D112 VPBE VDD for Bulk Erase 2.7 — VDDMAX V
D113 V
PEW VDD for Write or Row Erase VDDMIN —VDDMAX V
D114 I
PPPGM Current on MCLR/VPP during
Erase/Write
—1.0—mA
D115 I
DDPGM Current on VDD during
Erase/Write
—5.0—
mA
Program Flash Memory
D121 E
P Cell Endurance 10K — — E/W -40C TA +85C
(Note 1)
D122 V
PRW VDD for Read/Write VDDMIN —VDDMAX V
D123 TIW Self-timed Write Cycle Time — 2 2.5 ms
D124 TRETD Characteristic Retention — 40 — Year Provided no other
specifications are violated
D125 E
HEFC High-Endurance Flash Cell 100K — — E/W 0C TA +60°C, lower
byte last 128 addresses
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: Self-write and Block Erase.
2: Required only if single-supply programming is disabled.
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C T
A +125°C
Param
No.
Sym. Characteristic Typ. Units Conditions
TH01
JA Thermal Resistance Junction to Ambient 89.3 C/W 8-pin PDIP package
149.5 C/W 8-pin SOIC package
211 C/W 8-pin MSOP package
56.7 C/W 8-pin DFN 3X3mm package
68 C/W 8-pin DFN 2X3mm package
60 C/W 8-pin UDFN 2X3mm package
TH02
JC Thermal Resistance Junction to Case 43.1 C/W
8-pin PDIP package
39.9 C/W 8-pin SOIC package
39 C/W 8-pin MSOP package
10.7 C/W 8-pin DFN 3X3mm package
12.7 C/W 8-pin DFN 2X3mm package
11 C/W 8-pin UDFN 2X3mm package
TH03 T
JMAX Maximum Junction Temperature 150 C
TH04 PD Power Dissipation — W PD = P
INTERNAL + PI/O
TH05 PINTERNAL Internal Power Dissipation — W PINTERNAL = IDD x VDD
(1)
TH06 PI/O I/O Power Dissipation — W PI/O = (IOL * VOL) + (IOH * (VDD - VOH))
TH07 P
DER Derated Power — W PDER = PDMAX (TJ - TA)/JA
(2)
Note 1:IDD is current to run the chip alone without driving any load on the output pins.
2: T
A = Ambient Temperature.
3: T
J = Junction Temperature.