Datasheet

 2014 Microchip Technology Inc. Advance Information DS70005173A-page 5
MRF24J40MD/ME
1.2 Mounting Details
The MRF24J40MD/ME is a surface mountable mod-
ule. Module dimensions are shown in Figure 1-3. The
module Printed Circuit Board (PCB) is 0.032" thick
with castellated mounting points on the edge.
Figure 1-4 is a recommended host PCB footprint for
the MRF24J40MD/ME.
The MRF24J40MD has an integrated PCB antenna.
For the best performance, follow the mounting details
shown in Figure 1-5. It is recommended that the mod-
ule be mounted on the edge of the host PCB, and an
area around the antenna, approximately 1.2", be kept
clear of metal objects. A host PCB ground plane
around the MRF24J40MD acts as a counterpoise to
the PCB antenna. It is recommended to extend the
ground plane at least 0.4" around the module.
The MRF24J40ME has 50Ω ultra miniature coaxial
(U.FL) connector.
1.3 Soldering Recommendations
The MRF24J40MD/ME module was assembled using
a standard lead-free reflow profile. The module is com-
patible with standard lead-free solder reflow profiles. To
avoid damaging the module, the following recommen-
dations are given:
• Refer to the solder paste data sheet for specific
reflow profile recommendations
• Use no-clean flux solder paste
• Do not wash as moisture can be trapped under
the shield
• Use only one flow. If the PCB requires multiple
flows, apply the module on the last flow
FIGURE 1-3: MODULE DETAILS
Caution: The U.FL connector is fragile and can only
tolerate very limited number of insertions.