Datasheet

 2018 Microchip Technology Inc. DS20006006A-page 5
MIC5501/2/3/4
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters Sym. Min. Typ. Max. Units Conditions
Temperature Ranges
Storage Temperature Range T
S
–65 — +150 °C —
Maximum Junction Temperature Range T
J
–40 — +150 °C —
Operating Junction Temperature Range T
J
–40 — +125 °C —
Lead Temperature — — — +260 °C Soldering, 10s
Package Thermal Resistances
Thermal Resistance 1 mm x 1 mm Thin DFN-4 
JA
—250—°C/W—
Thermal Resistance SOT23-5 
JA
—253—°C/W—
Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., T
A
, T
J
, 
JA
). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.