Datasheet

MIC5219
DS20006021A-page 8  2018 Microchip Technology Inc.
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters Sym. Min. Typ. Max. Units Conditions
Temperature Ranges
Operating Ambient Temperature Range T
A
–40 — +125 °C —
Maximum Junction Temperature Range T
J
–40 — +125 °C —
Storage Temperature Range T
S
–65 — +150 °C —
Lead Temperature — — 260 — °C Soldering, 5 sec.
Package Thermal Resistances
Thermal Resistance, MSOP-8Ld 
JA
— 160 — °C/W Minimum footprint area.
Thermal Resistance, SOT23-5Ld 
JA
— 220 — °C/W Minimum footprint area.
Thermal Resistance, VDFN-6Ld 
JA
— 90 — °C/W Minimum footprint area.
Thermal Resistance, TDFN-6Ld 
JA
— 90 — °C/W Minimum footprint area.
Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., T
A
, T
J
, 
JA
). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.