Datasheet

 2018 Microchip Technology Inc. DS20006021A-page 23
MIC5219
RECOMMENDED LAND PATTERN
Dimension Limits
Units
Optional Center Pad Width
Optional Center Pad Length
Contact Pitch
Y2
X2
1.45
0.85
MILLIMETERS
0.65 BSC
MIN
E
MAX
Contact Pad Length (X6)
Contact Pad Width (X6)
Y1
X1
0.75
0.30
Microchip Technology Drawing C04-21016A
NOM
6-Lead Very Thin Plastic Dual Flat, No Lead Package (JDA) - 2x2 mm Body [VDFN]
SILK SCREEN
12
6
E
X1
Y1
G1
Y2
C1Contact Pad Spacing 2.00
Contact Pad to Center Pad (X6) G1 0.20
Thermal Via Diameter V 0.30
ØV
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M
For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
1.
2.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Micrel Legacy Package
C1
X2
0.330.27