Datasheet

 2017 Microchip Technology Inc. DS20005720A-page 15
MIC5209
FIGURE 4-6: PCB Heatsink Thermal
Resistance.
THERMAL RESISTANCE (ºC/W)
COPPER HEAT SINK AREA (mm
2
)
70
60
50
40
30
20
10
0
0 2000 4000 6000