Datasheet

ManualsBrandsMicrochip ManualsIntegrated Circuits (ICs)LDO Voltage Regulator, ... 5VDC, SOT-223-5

 2017 Microchip Technology Inc. DS20005720A-page 1

MIC5209

Features

• Output Voltage Range: 1.8V – 15V

• Meets Intel

Slot 1 and Slot 2 Requirements

• Guaranteed 500 mA Output Over the Full

Operating Temperature Range

• Low 500 mV Maximum Dropout Voltage at Full

Load

• Extremely Tight Load and Line Regulation

• Thermally Efﬁcient Surface-Mount Package

• Low Temperature Coefﬁcient

• Current and Thermal Limiting

• Reversed-Battery Protection

• No-Load Stability

• 1% Output Accuracy

• Ultra-Low-Noise Capability in SOIC-8 and DDPAK

• Ultra-Small 3 mm × 3 mm DFN Package

Applications

• Pentium II Slot 1 and Slot 2 Support Circuits

• Laptop, Notebook, and Palmtop Computers

• Cellular Telephones

• Consumer and Personal Electronics

• SMPS Post-Regulator and DC/DC Modules

• High-Efficiency Linear Power Supplies

General Description

The MIC5209 is an efficient linear voltage regulator

with very low dropout voltage, typically 10 mV at light

loads and less than 500 mV at full load, with better than

1% output voltage accuracy.

Designed especially for hand-held, battery-powered

devices, the MIC5209 features low ground current to

help prolong battery life. An enable/shutdown pin on

the SOIC-8 and DDPAK versions can further improve

battery life with near-zero shutdown current.

Key features include reversed-battery protection,

current limiting, overtemperature shutdown,

ultra-low-noise capability (SOIC-8 and DDPAK

versions), and is available in thermally efficient

packaging. The MIC5209 is available in adjustable or

fixed output voltages.

Typical Application Circuits

3.3V NOMINAL INPUT SLOT 1

POWER SUPPLY

ULTRA-LOW NOISE

5V REGULATOR

MIC5209-2.5YS

 3.0V

0.1μF

OUT

2.5V ±1%

22μF

TANTALUM

123

MIC5209-5.0YM

6.0V

OUT

5.0V

22μF

TANTALUM

ENABLE

SHUTDOWN

470pF

(OPTIONAL)

500 mA Low-Noise LDO Regulator

Summary of content (30 pages)

PAGE 1
MIC5209 500 mA Low-Noise LDO Regulator Features General Description • Output Voltage Range: 1.
PAGE 2
MIC5209 Package Types MIC5209-X.XYS SOT-223 (S) FIXED VOLTAGES (TOP VIEW) MIC5209YML 8-PIN 3X3 DFN (ML) ADJUSTABLE VOLTAGES (TOP VIEW) GND TAB IN 2 1 IN 2 OUT 3 OUT 4 Y 5209 YWW EP 3 EN 7 GND 6 ADJ 5 NC PART IDENTIFICATION MIC5209-X.
PAGE 3
MIC5209 Functional Diagrams LOW-NOISE FIXED REGULATOR (SOT-223 VERSION ONLY) IN VIN OUT VOUT COUT ~2.0V – 2.1V –40ºC EN BANDGAP REFERENCE CURRENT-LIMIT THERMAL SHUTDOWN MIC5209-x.xYS GND ULTRA-LOW-NOISE FIXED REGULATOR IN VIN OUT VOUT COUT BYP CBYP (OPTIONAL) BANDGAP REFERENCE EN CURRENT-LIMIT THERMAL SHUTDOWN MIC5209-x.
PAGE 4
MIC5209 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings † Supply Voltage (VIN).................................................................................................................................... –20V to +20V Power Dissipation (PD) (Note 1).............................................................................................................Internally Limited ESD Rating (SOT-223)...................................................................................................
PAGE 5
MIC5209 TABLE 1-1: ELECTRICAL CHARACTERISTICS (Note 1) Electrical Characteristics: VIN = VOUT + 1V; IL = 100 μA; TJ = +25°C, bold values indicate –40°C ≤ TJ ≤ +125°C except 0°C ≤ TJ ≤ +125°C for 1.8V ≤ VOUT ≤ 2.5V, unless noted.
PAGE 6
MIC5209 TABLE 1-1: ELECTRICAL CHARACTERISTICS (Note 1) (CONTINUED) Electrical Characteristics: VIN = VOUT + 1V; IL = 100 μA; TJ = +25°C, bold values indicate –40°C ≤ TJ ≤ +125°C except 0°C ≤ TJ ≤ +125°C for 1.8V ≤ VOUT ≤ 2.5V, unless noted. Parameter Symbol Min. Typ. Max. Enable Input Logic-Low Voltage — — 0.4 VENL — — 0.18 2.0 — — Enable Input Current IENL — 0.01 –1 — 0.
PAGE 7
MIC5209 TEMPERATURE SPECIFICATIONS (Note 1) Parameters Sym. Min. Typ. Max. Units Conditions TS –65 — +150 °C — Temperature Ranges Storage Temperature Range Lead Temperature — — — +260 °C Soldering, 5 sec. Junction Temperature TJ –40 — +125 °C 2.5V ≤ VOUT ≤ 15V Junction Temperature TJ 0 — +125 °C 1.8V ≤ VOUT < 2.5V θJA — 62 — °C/W θJC — 15 — °C/W θJA — 50 — °C/W θJC — 25 — °C/W θJA — 31.
PAGE 8
MIC5209 2.0 Note: TYPICAL PERFORMANCE CURVES The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. FIGURE 2-1: Ratio.
PAGE 9
MIC5209 FIGURE 2-7: Power Supply Ripple Rejection vs. Voltage Drop. FIGURE 2-10: Noise Performance. FIGURE 2-8: Power Supply Ripple Rejection vs. Voltage Drop. FIGURE 2-11: Noise Performance. FIGURE 2-9: FIGURE 2-12: Current. Dropout Voltage vs. Output Noise Performance.  2017 Microchip Technology Inc.
PAGE 10
MIC5209 FIGURE 2-13: Current. Ground Current vs. Output FIGURE 2-14: Voltage. Ground Current vs. Supply FIGURE 2-15: Voltage. Ground Current vs. Supply DS20005720A-page 10  2017 Microchip Technology Inc.
PAGE 11
MIC5209 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: Pin Number 8-Pin DFN PIN FUNCTION TABLE Pin Number SOT-223 Pin Number SOIC-8 Pin Number DDPAK Pin Name Description 1, 2 1 2 2 IN 7 2, TAB 5, 6, 7, 8 3, TAB GND Ground: SOT-223 Pin 2 and TAB are internally connected. SOIC-8 Pins 5 through 8 are internally connected. 3, 4 3 3 4 OUT Regulator Output: Pins 3 and 4 must be tied together. 5 — — — NC Not Connected.
PAGE 12
MIC5209 4.0 APPLICATIONS INFORMATION 4.1 Enable/Shutdown Enable is not available on devices in the SOT-223 (S) package. Forcing EN (enable/shutdown) high (> 2V) enables the regulator. EN is compatible with CMOS logic. If the enable/shutdown feature is not required, connect EN to IN (supply input). 4.2 Input Capacitor A 1 µF capacitor should be placed from IN to GND if there is more than 10 inches of wire between the input and the AC filter capacitor or if a battery is used as the input. 4.
PAGE 13
MIC5209 larger output and bypass capacitors allows additional time for the error amplifier and reference to turn on and prevent overshoot. To ensure that no overshoot is present when starting up into a light load (100 µA), use a 4.7 µF output capacitance and 470 pF bypass capacitance. This slows the turn-on enough to allow the regulator to react and keep the output voltage from exceeding its nominal value. At heavier loads, use a 10 µF output capacitance and 470 pF bypass capacitance.
PAGE 14
MIC5209 the number of clock outputs, and the type of level shifter (from core logic levels to 2.5V levels). Intel estimates a “worst-case” load of 320 mA. The MIC5209 was designed to provide the 2.5V power requirement for Slot-1 applications. Its guaranteed performance of 2.5V ±3% at 500 mA allows adequate margin for all systems, and the dropout voltage of 500 mV means that it operates from a “worst-case” 3.3V supply where the voltage can be as low as 3.0V. 1 IN CIN 0.
PAGE 15
THERMAL RESISTANCE (ºC/W) MIC5209 70 60 50 40 30 20 10 0 0 2000 4000 6000 COPPER HEAT SINK AREA (mm2) FIGURE 4-6: Resistance. PCB Heatsink Thermal  2017 Microchip Technology Inc.
PAGE 16
MIC5209 5.0 PACKAGING INFORMATION 5.1 Package Marking Information 5-Pin SOT-223* Example XXXX XXXXYWWP 5209 25YS722P SOIC-8 (Fixed)* Example XXXX -X.XXX WNNN 5209 -3.3YM 9651 SOIC-8 (Adj.)* Example XXX XXXXXX WNNN MIC 5209YM 1312 5-Pin DDPAK (Fixed)* Example XXXX -X.XXX WNNNP 5209 -3.3YU 5492P 5-Pin DDPAK (Adj)* Example XXX XXXXXX WNNNP MIC 5209YU 1975P 8-Pin DFN* Example X XXXX NNN DS20005720A-page 16 Y 5209 916  2017 Microchip Technology Inc.
PAGE 17
MIC5209 Legend: XX...X Y YY WW NNN e3 * Product code or customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC® designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. ●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle mark).
PAGE 18
MIC5209 3-Lead SOT-223 Package Outline and Recommended Land Pattern Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging. DS20005720A-page 18  2017 Microchip Technology Inc.
PAGE 19
MIC5209 5-Lead DDPAK Package Outline and Recommended Land Pattern /HDG 3ODVWLF (7 >''3$.
PAGE 20
MIC5209 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20005720A-page 20  2017 Microchip Technology Inc.
PAGE 21
MIC5209 8-Lead 3 mm x 3 mm DFN Package Outline and Recommended Land Pattern Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging.  2017 Microchip Technology Inc.
PAGE 22
MIC5209 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging. DS20005720A-page 22  2017 Microchip Technology Inc.
PAGE 23
MIC5209 8-Lead SOIC Package Outline and Recommended Land Pattern Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging.  2017 Microchip Technology Inc.
PAGE 24
MIC5209 NOTES: DS20005720A-page 24  2017 Microchip Technology Inc.
PAGE 25
MIC5209 APPENDIX A: REVISION HISTORY Revision A (February 2017) • Converted Micrel document MIC5209 to Microchip data sheet DS20005720A. • Minor text changes throughout. • Updated TO-263-5 packaging spec to DDPAK. • Updated Thermal Resistance values to be current with Microchip packaging.  2017 Microchip Technology Inc.
PAGE 26
MIC5209 NOTES: DS20005720A-page 26  2017 Microchip Technology Inc.
PAGE 27
MIC5209 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office. – PART NO. Device X X.X Voltage Device: MIC5209: Voltage: (blank) 1.8 2.5 3.0 3.3 3.6 4.2 5.0 = = = = = = = = X – XX Examples: a) MIC5209-1.8YM-TR: 500 mA Low-Noise LDO Regulator, 1.8V Voltage, –40°C to +125°C Temp. Range, 8-Lead SOIC, 2,500/Reel b) MIC5209-1.8YM: 500 mA Low-Noise LDO Regulator, 1.8V Voltage, –40°C to +125°C Temp.
PAGE 28
MIC5209 NOTES: DS20005720A-page 28  2017 Microchip Technology Inc.
PAGE 29
Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature.
PAGE 30
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