Datasheet

2017 Microchip Technology Inc. DS20005785A-page 5
MIC5205
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters Sym. Min. Typ. Max. Units Conditions
Temperature Ranges
Junction Operating Temperature
Range
T
J
–40 +125 °C
Storage Temperature Range T
S
–65 +150 °C
Lead Temperature +260 °C Soldering, 5s
Package Thermal Resistances
Thermal Resistance SOT-23-5
JA
—220 °C/WNote 2
JC
—130 °C/W
Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., T
A
, T
J
,
JA
). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
2: The maximum allowable power dissipation at any T
A
(ambient temperature) is P
D(max)
= (T
J(max)
– T
A
)/
JA
.
Exceeding the maximum allowable power dissipation will result in excessive die temperature, and the reg-
ulator will go into thermal shutdown. The
JA
of the MIC5205-xxYM5 (all versions) is 220°C/W mounted on
a PC board.