Datasheet

 2012-2018 Microchip Technology Inc. DS20002300C-page 49
MCP7951X/MCP7952X
RECOMMENDED LAND PATTERN
Microchip Technology Drawing No. C04-2021B
10-Lead Plastic Micro Small Outline Package (MS) [MSOP]
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M1.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Dimension Limits
Units
CContact Pad Spacing
Overall Width
Contact Pitch
Z
MILLIMETERS
0.50 BSC
MIN
E
MAX
4.40
5.80
Contact Pad Length (X10)
Contact Pad Width (X10)
Y1
X1
1.40
0.30
GDistance Between Pads (X8) 0.20
NOM
Distance Between Pads (X5) G1 3.00
E
C
Z
G1
X1
G
Y1
SILK SCREEN