Datasheet

 2012-2018 Microchip Technology Inc. DS20002300C-page 48
MCP7951X/MCP7952X
Microchip Technology Drawing C04-021D Sheet 2 of 2
10-Lead Plastic Micro Small Outline Package (MS) [MSOP]
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
REF: Reference Dimension, usually without tolerance, for information purposes only.
3.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
1.
Notes:
2.
Pin 1 visual index feature may vary, but must be located within the hatched area.
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
Dimensioning and tolerancing per ASME Y14.5M.
protrusions shall not exceed 0.15mm per side.
L1Footprint
Mold Draft Angle
Lead Width
Lead Thickness
c
b
Dimension Limits
Overall Height
Molded Package Thickness
Molded Package Width
Overall Length
Foot Length
Standoff
Overall Width
Number of Pins
Pitch
A
L
E1
D
A1
E
A2
e
N
Units
0.95 REF
-
-
0.08
0.15
0.23
0.33
MILLIMETERS
0.50 BSC
0.85
3.00 BSC
3.00 BSC
0.60
4.90 BSC
0.40
0.00
0.75
MIN
NOM
1.10
0.80
0.15
0.95
MAX
10
-
--
8°0°
-
C
SEATING
PLANE
L
(L1)
c
Ĭ
Ĭ
DETAIL A
Foot Angle - 15°5°
Ĭ1
4X Ĭ1
4X Ĭ1