Datasheet
2001-2013 Microchip Technology Inc. DS21669D-page 17
MCP6041/2/3/4
6.0 PACKAGING INFORMATION
6.1 Package Marking Information
8-Lead MSOP
Example:
XXXXXX
YWWNNN
6043I
304256
5-Lead SOT-23 (MCP6041)
Example:
XXNN 7X25
Device
I-Temp
Code
E-Temp
Code
MCP6041/T-E/OT SPNN 7XNN
Note: Parts with date codes prior to
November 2012 have their package
markings in the SBNN format.
6-Lead SOT-23 (MCP6043)
Example:
XXNN SC25
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
* This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
Device
I-Temp
Code
E-Temp
Code
MCP6043T-E/CH SCNN SDNN
XXXXXXXX
XXXXXNNN
YYWW
8-Lead PDIP (300 mil)
Example:
8-Lead SOIC (150 mil)
Example
:
XXXXXXXX
XXXXYYWW
NNN
MCP6041
I/P256
1304
MCP6042
I/SN1304
256
MCP6041
I/P 256
1304
MCP6042I
SN 1304
256
3
e
OR
OR
3
e