MCP6041/2/3/4 600 nA, Rail-to-Rail Input/Output Op Amps Features Description • • • • • • • • • The MCP6041/2/3/4 family of operational amplifiers (op amps) from Microchip Technology Inc. operate with a single supply voltage as low as 1.4V, while drawing less than 1 µA (maximum) of quiescent current per amplifier. These devices are also designed to support rail-to-rail input and output operation. This combination of features supports battery-powered and portable applications.
MCP6041/2/3/4 1.0 ELECTRICAL CHARACTERISTICS † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings † VDD – VSS ...................................
MCP6041/2/3/4 AC ELECTRICAL CHARACTERISTICS Electrical Characteristics: Unless otherwise indicated, VDD = +1.4V to +5.5V, VSS = GND, TA = 25°C, VCM = VDD/2, VOUT VDD/2, VL = VDD/2, RL = 1 Mto VL, and CL = 60 pF (refer to Figure 1-2 and Figure 1-3). Parameters Sym Min Typ Max Units Conditions AC Response Gain Bandwidth Product GBWP — 14 — kHz Slew Rate SR — 3.0 — V/ms Phase Margin PM — 65 — ° Input Voltage Noise Eni — 5.
MCP6041/2/3/4 TEMPERATURE CHARACTERISTICS Electrical Characteristics: Unless otherwise indicated, VDD = +1.4V to +5.5V, VSS = GND.
MCP6041/2/3/4 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
MCP6041/2/3/4 Note: Unless otherwise indicated, TA = +25°C, VDD = +1.4V to +6.0V, VSS = GND, VCM = VDD/2, VOUT VDD/2, VL = VDD/2, RL = 1 M to VL, and CL = 60 pF. 6 Input, Output Voltages (V) 450 VDD = 1.4V 400 350 VDD = 5.5V 300 250 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 Output Voltage (V) FIGURE 2-7: Output Voltage. Input Offset Voltage vs. 4 VIN 2 1 0 Input Noise Voltage Density (nV/ Hz) VDD = 5.
MCP6041/2/3/4 Note: Unless otherwise indicated, TA = +25°C, VDD = +1.4V to +6.0V, VSS = GND, VCM = VDD/2, VOUT VDD/2, VL = VDD/2, RL = 1 M to VL, and CL = 60 pF. Input Bias and Offset Currents (pA) 10000 10k VDD = 5.5V VCM = VDD 1k 1000 100 IB 10 | IOS | 1 1 0.1 0.1 45 55 65 75 85 95 105 115 Ambient Temperature (°C) 125 FIGURE 2-13: Input Bias, Offset Currents vs. Ambient Temperature. -60 Phase 60 -90 40 -120 20 -150 0 -180 Open-Loop Gain, Phase vs.
MCP6041/2/3/4 FIGURE 2-19: Channel-to-Channel Separation vs. Frequency (MCP6042 and MCP6044 only). PM (G = +1) 14 90 18 80 16 70 12 60 10 50 GBWP 8 40 6 30 4 20 2 10 VDD = 1.4V 0 -50 -25 0 25 50 75 100 Ambient Temperature (°C) 0.7 0.6 0.5 0.4 0.3 TA = +125°C TA = +85°C TA = +25°C TA = -40°C 0.2 0.1 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 Power Supply Voltage (V) FIGURE 2-21: Quiescent Current vs. Power Supply Voltage. DS21669D-page 8 5.5 5.0 4.5 4.
MCP6041/2/3/4 Note: Unless otherwise indicated, TA = +25°C, VDD = +1.4V to +6.0V, VSS = GND, VCM = VDD/2, VOUT VDD/2, VL = VDD/2, RL = 1 M to VL, and CL = 60 pF. 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 Output Voltage Headroom, VDD – V OH or V OL – V SS (mV) Output Voltage Headroom; VDD – V OH or V OL – V SS (mV) 1000 100 VDD – VOH VOL – VSS 10 1 0.01 0.1 1 Output Current Magnitude (mA) 10 5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.
MCP6041/2/3/4 Note: Unless otherwise indicated, TA = +25°C, VDD = +1.4V to +6.0V, VSS = GND, VCM = VDD/2, VOUT VDD/2, VL = VDD/2, RL = 1 M to VL, and CL = 60 pF. 5.0 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0.0 2 FIGURE 2-31: Pulse Response. 7.5 5.0 2.5 0.0 -2.5 -5.0 -7.5 -10.0 -12.5 -15.0 -17.5 -20.0 3 Time 4 (15ms/div) 6 7 8 9 Large Signal Non-inverting CS VDD = 5.0V Output On VOUT High-Z 0 1 High-Z 2 10 3 Time 4 (15 ms/div) 6 7 8 9 5.0 4.5 4.0 3.5 3.0 2.
MCP6041/2/3/4 3.0 PIN DESCRIPTIONS Descriptions of the pins are listed in Table 3-1.
MCP6041/2/3/4 4.0 APPLICATIONS INFORMATION The MCP6041/2/3/4 family of op amps is manufactured using Microchip’s state of the art CMOS process. These op amps are unity gain stable and suitable for a wide range of general purpose, low-power applications. See Microchip’s related MCP6141/2/3/4 family of op amps for applications, at a gain of 10 V/V or higher, needing greater bandwidth. 4.1 Rail-to-Rail Input 4.1.1 dump any currents onto VDD.
MCP6041/2/3/4 4.2 Rail-to-Rail Output 4.4 Capacitive Loads There are two specifications that describe the output swing capability of the MCP6041/2/3/4 family of op amps. The first specification (Maximum Output Voltage Swing) defines the absolute maximum swing that can be achieved under the specified load condition. Thus, the output voltage swings to within 10 mV of either supply rail with a 50 k load to VDD/2.
MCP6041/2/3/4 4.5 MCP6043 Chip Select 4.8 The MCP6043 is a single op amp with Chip Select (CS). When CS is pulled high, the supply current drops to 50 nA (typical) and flows through the CS pin to VSS. When this happens, the amplifier output is put into a high impedance state. By pulling CS low, the amplifier is enabled. If the CS pin is left floating, the amplifier may not operate properly. Figure 1-1 shows the output voltage and supply current response to a CS pulse. 4.
MCP6041/2/3/4 4.9 4.9.1 Application Circuits 4.9.2 BATTERY CURRENT SENSING The MCP6041/2/3/4 op amps’ Common Mode Input Range, which goes 0.3V beyond both supply rails, supports their use in high-side and low-side battery current sensing applications. The very low quiescent current (0.6 µA, typical) helps prolong battery life, and the rail-to-rail output supports detection low currents. Figure 4-7 shows a high-side battery current sensor circuit. The 10 resistor is sized to minimize power losses.
MCP6041/2/3/4 5.0 DESIGN AIDS Microchip provides the basic design tools needed for the MCP6041/2/3/4 family of op amps. 5.1 SPICE Macro Model The latest SPICE macro model for the MCP6041/2/3/4 op amps is available on the Microchip web site at www.microchip.com. This model is intended to be an initial design tool that works well in the op amp’s linear region of operation over the temperature range. See the model file for information on its capabilities.
MCP6041/2/3/4 6.0 PACKAGING INFORMATION 6.1 Package Marking Information Example: 5-Lead SOT-23 (MCP6041) XXNN Device I-Temp Code E-Temp Code MCP6041/T-E/OT SPNN 7XNN Note: Parts with date codes prior to November 2012 have their package markings in the SBNN format.
MCP6041/2/3/4 Package Marking Information (Continued) Example: 14-Lead PDIP (300 mil) (MCP6044) MCP6044-I/P XXXXXXXXXXXXXX XXXXXXXXXXXXXX YYWWNNN 1304256 MCP6044 E/P e3 1304256 OR 14-Lead SOIC (150 mil) (MCP6044) Example: MCP6044ISL e3 I/SL^^ 1304256 XXXXXXXXXX XXXXXXXXXX YYWWNNN MCP6044 E/SL^^ e3 1304256 OR Example: 14-Lead TSSOP (MCP6044) XXXXXXXX YYWW 6044ST 1304 NNN 256 OR 6044EST 1304 256 DS21669D-page 18 2001-2013 Microchip Technology Inc.
MCP6041/2/3/4 .
MCP6041/2/3/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS21669D-page 20 2001-2013 Microchip Technology Inc.
MCP6041/2/3/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2001-2013 Microchip Technology Inc.
MCP6041/2/3/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS21669D-page 22 2001-2013 Microchip Technology Inc.
MCP6041/2/3/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2001-2013 Microchip Technology Inc.
MCP6041/2/3/4 ! " ## $ % .
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MCP6041/2/3/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS21669D-page 26 2001-2013 Microchip Technology Inc.
MCP6041/2/3/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2001-2013 Microchip Technology Inc.
MCP6041/2/3/4 ( " )* +,# $ % !- . # # $ # / ## +22--- 2 DS21669D-page 28 ! - / 0 # 1 / % # # ! # 2001-2013 Microchip Technology Inc.
MCP6041/2/3/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2001-2013 Microchip Technology Inc.
MCP6041/2/3/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS21669D-page 30 2001-2013 Microchip Technology Inc.
MCP6041/2/3/4 . # # $ # / ## +22--- 2 2001-2013 Microchip Technology Inc.
MCP6041/2/3/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS21669D-page 32 2001-2013 Microchip Technology Inc.
MCP6041/2/3/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2001-2013 Microchip Technology Inc.
MCP6041/2/3/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS21669D-page 34 2001-2013 Microchip Technology Inc.
MCP6041/2/3/4 APPENDIX A: REVISION HISTORY Revision D (March 2013) The following is the list of modifications: 1. 2. 3. Updated the boards list in Section 5.4 “Analog Demonstration and Evaluation Boards”. Removed the Mindi™ Circuit Designer & Simulator section. Updated the E-Temp Code value for the 5-Lead SOT-23 package in Section 6.0 “Packaging Information”. Revision C (February 2008) The following is the list of modifications: 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18.
MCP6041/2/3/4 NOTES: DS21669D-page 36 2001-2013 Microchip Technology Inc.
MCP6041/2/3/4 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO.
MCP6041/2/3/4 NOTES: DS21669D-page 38 2001-2013 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature.
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