MCP6021/1R/2/3/4 Rail-to-Rail Input/Output, 10 MHz Op Amps Features Description • • • • The MCP6021, MCP6021R, MCP6022, MCP6023 and MCP6024 from Microchip Technology Inc. are rail-torail input and output operational amplifiers with high performance. Key specifications include: wide bandwidth (10 MHz), low noise (8.7 nV/Hz), low input offset voltage and low distortion (0.00053% THD+N). The MCP6023 also offers a Chip Select pin (CS) that gives power savings when the part is not in use.
MCP6021/1R/2/3/4 NOTES: DS20001685E-page 2 2001-2017 Microchip Technology Inc.
MCP6021/1R/2/3/4 1.0 † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings† VDD – VSS .................................
MCP6021/1R/2/3/4 AC ELECTRICAL CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, TA = +25°C, VDD = +2.5V to +5.5V, VSS = GND, VCM = VDD/2, VOUT VDD/2, RL = 10 kto VDD/2 and CL = 60 pF. Parameters Sym. Min. Typ. Max. Units GBWP — 10 — MHz Conditions AC Response Gain Bandwidth Product Phase Margin Settling Time, 0.2% Slew Rate PM — 65 — ° tSETTLE — 250 — ns SR — 7.
MCP6021/1R/2/3/4 TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, VDD = +2.5V to +5.5V and VSS = GND. Parameters Sym. Min. Typ. Max.
MCP6021/1R/2/3/4 NOTES: DS20001685E-page 6 2001-2017 Microchip Technology Inc.
MCP6021/1R/2/3/4 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
MCP6021/1R/2/3/4 Note: Unless otherwise indicated, TA = +25°C, VDD = +2.5V to +5.5V, VSS = GND, VCM = VDD/2, VOUT VDD/2, RL = 10 k to VDD/2 and CL = 60 pF. 200 Input Offset Voltage (µV) 50 0 -50 -100 -150 -200 VDD = 5.0V VCM = 0V -250 -300 100 0 -100 -150 125 FIGURE 2-10: Output Voltage. FIGURE 2-8: vs. Frequency. 1.E+05 100k 1.E+06 1M Input Noise Voltage Density 5.5 1.E+04 10k 5.0 1.E+03 4.5 1.E+02 10 100 1k Frequency (Hz) 4.0 1.E+01 1 3.5 1.E+00 3.0 1.E-01 0.
MCP6021/1R/2/3/4 1,000 IB, TA = +125°C IOS, TA = +125°C IB, TA = +85°C 100 10 IOS, TA = +85°C 1 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 Common Mode Input Voltage (V) Quiescent Current (mA/amplifier) FIGURE 2-13: Input Bias, Offset Currents vs. Common-Mode Input Voltage. 1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 +125°C +85°C +25°C -40°C 10,000 VCM = VDD VDD = 5.5V 1,000 Quiescent Current vs. 1 25 35 45 55 65 75 85 95 105 115 125 Ambient Temperature (°C) FIGURE 2-16: vs.
MCP6021/1R/2/3/4 Note: Unless otherwise indicated, TA = +25°C, VDD = +2.5V to +5.5V, VSS = GND, VCM = VDD/2, VOUT VDD/2, RL = 10 k to VDD/2 and CL = 60 pF. 120 VDD = 2.5V 100 90 1.E+02 1.E+03 100 1.E+04 FIGURE 2-19: Load Resistance. 100k DC Open-Loop Gain vs. VDD = 2.5V 100 95 -25 0 25 50 75 Ambient Temperature (°C) FIGURE 2-22: Temperature. 100 VDD = 5.5V 100 90 VDD = 2.5V 80 0.05 0.10 0.15 0.20 0.25 Output Voltage Headroom (V); VDD - VOH or VOL - VSS 0.
MCP6021/1R/2/3/4 11 10 9 8 7 6 5 4 3 2 1 0 10 Falling, VDD = 5.5V Rising, VDD = 5.5V Maximum Output Voltage Swing (VP-P) Slew Rate (V/µs) Note: Unless otherwise indicated, TA = +25°C, VDD = +2.5V to +5.5V, VSS = GND, VCM = VDD/2, VOUT VDD/2, RL = 10 k to VDD/2 and CL = 60 pF. Falling, VDD = 2.5V Rising, VDD = 2.5V -50 -25 0 25 50 75 Ambient Temperature (°C) FIGURE 2-25: 100 1.E+05 1.E+06 100k Frequency (Hz) THD+N (%) G = +100 V/V G = +100 V/V G = +10 V/V 0.0100% G = +10 V/V 0.
MCP6021/1R/2/3/4 Note: Unless otherwise indicated, TA = +25°C, VDD = +2.5V to +5.5V, VSS = GND, VCM = VDD/2, VOUT VDD/2, RL = 10 k to VDD/2 and CL = 60 pF. Output Voltage Headroom VDD – VOH or VOL – VSS (mV) Output Voltage Headroom; VDD – VOH or VOL – VSS (mV) 1,000 100 10 VOL – VSS VDD – VOH 1 0.01 0.1 1 Output Current Magnitude (mA) 10 9 8 7 6 5 4 3 2 1 0 10 FIGURE 2-31: Output Voltage Headroom vs. Output Current.
MCP6021/1R/2/3/4 50 40 30 20 10 0 -10 -20 -30 -40 -50 VREF Accuracy; VREF – VDD/2 (mV) VREF Accuracy; VREF – VDD/2 (mV) Note: Unless otherwise indicated, TA = +25°C, VDD = +2.5V to +5.5V, VSS = GND, VCM = VDD/2, VOUT VDD/2, RL = 10 k to VDD/2 and CL = 60 pF. 50 40 30 20 10 0 -10 -20 -30 -40 -50 1.4 1.2 Quiescent Current (mA/amplifier) Quiescent Current (mA/amplifier) 1.6 Op Amp shuts off here Op Amp turns on here 1.0 CS swept high to low 0.8 Hysteresis 0.6 0.
MCP6021/1R/2/3/4 NOTES: DS20001685E-page 14 2001-2017 Microchip Technology Inc.
MCP6021/1R/2/3/4 3.0 PIN DESCRIPTIONS Descriptions of the pins are listed in Table 3-1.
MCP6021/1R/2/3/4 NOTES: DS20001685E-page 16 2001-2017 Microchip Technology Inc.
MCP6021/1R/2/3/4 4.0 APPLICATIONS INFORMATION The MCP6021/1R/2/3/4 family of operational amplifiers is fabricated on Microchip’s state-of-the-art CMOS process. The amplifiers are unity-gain stable and suitable for a wide range of general purpose applications. 4.1 D1 U1 D2 V1 MCP602X Rail-to-Rail Input 4.1.1 VDD VOUT V2 PHASE REVERSAL The MCP6021/1R/2/3/4 operational amplifiers are designed to prevent phase reversal when the input pins exceed the supply voltages.
MCP6021/1R/2/3/4 4.3 Capacitive Loads 4.4 Driving large capacitive loads can cause stability problems for voltage feedback operational amplifiers. As the load capacitance increases, the feedback loop’s phase margin decreases and the closed loop bandwidth is reduced. This produces gain peaking in the frequency response, with overshoot and ringing in the step response. When driving large capacitive loads with these operational amplifiers (e.g.
MCP6021/1R/2/3/4 4.6 MCP6021 and MCP6023 Reference Voltage The single operational amplifiers (MCP6021 and MCP6023), not in the SOT-23-5 package, have an internal mid-supply reference voltage connected to the VREF pin (see Figure 4-8). The MCP6021 has CS internally tied to VSS, which always keeps the operational amplifier on and always provides a mid-supply reference. With the MCP6023, taking the CS pin high conserves power by shutting down both the operational amplifier and the VREF circuitry.
MCP6021/1R/2/3/4 4.9 PCB Surface Leakage In applications where low input bias current is critical, PCB (Printed Circuit Board) surface leakage effects need to be considered. Surface leakage is caused by humidity, dust or other contamination on the board. Under low humidity conditions, a typical resistance between nearby traces is 1012. A 5V difference would cause 5 pA of current to flow, which is greater than the MCP6021/1R/2/3/4 family’s bias current at +25°C (1 pA, typical).
MCP6021/1R/2/3/4 4.11.2 OPTICAL DETECTOR AMPLIFIER Figure 4-14 shows the MCP6021 operational amplifier used as a transimpedance amplifier in a photo detector circuit. The photo detector looks like a capacitive current source, so the 100 k resistor gains the input signal to a reasonable level. The 5.6 pF capacitor stabilizes this circuit and produces a flat frequency response with a bandwidth of 370 kHz. Photo Detector 5.
MCP6021/1R/2/3/4 NOTES: DS20001685E-page 22 2001-2017 Microchip Technology Inc.
MCP6021/1R/2/3/4 5.0 DESIGN AIDS Microchip provides the basic design tools needed for the MCP6021/1R/2/3/4 family of operational amplifiers. 5.1 SPICE Macro Model The latest SPICE macro model available for the MCP6021/1R/2/3/4 operational amplifiers is on Microchip’s web site at www.microchip.com. This model is intended as an initial design tool that works well in the operational amplifier’s linear region of operation at room temperature.
MCP6021/1R/2/3/4 NOTES: DS20001685E-page 24 2001-2017 Microchip Technology Inc.
MCP6021/1R/2/3/4 6.0 PACKAGING INFORMATION 6.1 Package Marking Information 5-Lead SOT-23 (MCP6021/MCP6021R) Example: Device MCP6021 EYNN MCP6021R EZNN Note: 8-Lead PDIP (300 mil) E-Temp Code Applies to 5-Lead SOT-23. Example: MCP6021 I/P256 1603 8-Lead SOIC (150 mil) e3 * Note: OR MCP6021 E/P e3 256 1603 Example: MCP6021 I/SN1603 256 Legend: XX...
MCP6021/1R/2/3/4 Package Marking Information (Continued) 8-Lead MSOP Example: 6021E 903256 8-Lead TSSOP Example: 6021 E903 256 14-Lead PDIP (300 mil) (MCP6024) Example: MCP6024-I/P 0903256 OR MCP6024-E/P e3 0903256 DS20001685E-page 26 2001-2017 Microchip Technology Inc.
MCP6021/1R/2/3/4 Package Marking Information (Continued) 14-Lead SOIC (150 mil) (MCP6024) Example: MCP6024-I/SL 1603256 OR MCP6024 E/SL e3 1603256 14-Lead TSSOP (MCP6024) Example: 6024E 1603 256 2001-2017 Microchip Technology Inc.
MCP6021/1R/2/3/4 5-Lead Plastic Small Outline Transistor (OT) [SOT23] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 0.20 C 2X D e1 A D N E/2 E1/2 E1 E (DATUM D) (DATUM A-B) 0.15 C D 2X NOTE 1 1 2 e B NX b 0.20 C A-B D TOP VIEW A A A2 0.20 C SEATING PLANE A SEE SHEET 2 C A1 SIDE VIEW Microchip Technology Drawing C04-028D [OT] Sheet 1 of DS20001685E-page 28 2001-2017 Microchip Technology Inc.
MCP6021/1R/2/3/4 5-Lead Plastic Small Outline Transistor (OT) [SOT23] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging c T L L1 VIEW A-A SHEET 1 Units Dimension Limits Number of Pins N e Pitch e1 Outside lead pitch Overall Height A Molded Package Thickness A2 Standoff A1 E Overall Width E1 Molded Package Width D Overall Length L Foot Length Footprint L1 I Foot Angle c Lead Thickness b Lead Width MIN 0.90 0.
MCP6021/1R/2/3/4 5-Lead Plastic Small Outline Transistor (OT) [SOT23] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging X SILK SCREEN 5 Y Z C G 1 2 E GX RECOMMENDED LAND PATTERN Units Dimension Limits E Contact Pitch C Contact Pad Spacing X Contact Pad Width (X5) Contact Pad Length (X5) Y Distance Between Pads G Distance Between Pads GX Overall Width Z MIN MILLIMETERS NOM 0.95 BSC 2.80 MAX 0.60 1.10 1.
MCP6021/1R/2/3/4 8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A N B E1 NOTE 1 1 2 TOP VIEW E C A2 A PLANE L c A1 e eB 8X b1 8X b .010 C SIDE VIEW END VIEW Microchip Technology Drawing No. C04-018D Sheet 1 of 2 2001-2017 Microchip Technology Inc.
MCP6021/1R/2/3/4 8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.
MCP6021/1R/2/3/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2001-2017 Microchip Technology Inc.
MCP6021/1R/2/3/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20001685E-page 34 2001-2017 Microchip Technology Inc.
MCP6021/1R/2/3/4 & ! " #$% ! " # $ % & "' " " ( $ ) % *++&&& ! !+ $ 2001-2017 Microchip Technology Inc.
MCP6021/1R/2/3/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20001685E-page 36 2001-2017 Microchip Technology Inc.
MCP6021/1R/2/3/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2001-2017 Microchip Technology Inc.
MCP6021/1R/2/3/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20001685E-page 38 2001-2017 Microchip Technology Inc.
MCP6021/1R/2/3/4 & '( ( ) ' * * ! "' % ! " # $ % & "' " " ( $ ) % *++&&& ! !+ $ D N E E1 NOTE 1 1 2 b e c A φ A2 A1 L L1 @ " ! " A ! " E#!7 ) ( " AA 8 8 E E EG H ( G3 K L L 1 1 ; 1 ; L 1; % % ( $ $ "" % )) J; > ? 1 G3 N % 8 % % ( $ N % 81
MCP6021/1R/2/3/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20001685E-page 40 2001-2017 Microchip Technology Inc.
MCP6021/1R/2/3/4 +* & , # ! " ,# % ! " # $ % & "' " " ( $ ) % *++&&& ! !+ $ N NOTE 1 E1 1 3 2 D E A2 A L A1 c b1 b e eB @ " ! " A ! " E#!7 ) ( " E?K8 E E ( H 1 ( EG 1 > ? L L 1 11; 1< 1 ; > " ( 1 1; L L 8 <1 < ; % % ( $ # % $ "" # %
MCP6021/1R/2/3/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20001685E-page 42 2001-2017 Microchip Technology Inc.
MCP6021/1R/2/3/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2001-2017 Microchip Technology Inc.
MCP6021/1R/2/3/4 & ! " # $ % & "' " " ( $ ) % *++&&& ! !+ $ DS20001685E-page 44 2001-2017 Microchip Technology Inc.
MCP6021/1R/2/3/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2001-2017 Microchip Technology Inc.
MCP6021/1R/2/3/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20001685E-page 46 2001-2017 Microchip Technology Inc.
MCP6021/1R/2/3/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2001-2017 Microchip Technology Inc.
MCP6021/1R/2/3/4 NOTES: DS20001685E-page 48 2001-2017 Microchip Technology Inc.
MCP6021/1R/2/3/4 APPENDIX A: REVISION HISTORY Revision E (January 2017) Revision B (November 2003) • Second Release of this Document The following is the list of modifications: Revision A (November 2001) 1. 2. • Original Release of this Document 3. 4. Updated the AC Electrical Characteristics table. Added Section 4.1.2, Input Voltage Limits and Section 4.1.3, Input Current Limits. Added package information for 8-pin TSSOP. Various typographical edits.
MCP6021/1R/2/3/4 NOTES: DS20001685E-page 50 2001-2017 Microchip Technology Inc.
MCP6021/1R/2/3/4 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. [X](1) PART NO.
MCP6021/1R/2/3/4 NOTES: DS20001685E-page 52 2001-2017 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature.
Worldwide Sales and Service AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://www.microchip.com/ support Web Address: www.microchip.