Datasheet

© 2009 Microchip Technology Inc. DS21733J-page 35
MCP6001/1R/1U/2/4
APPENDIX A: REVISION HISTORY
Revision J (November 2009)
The following is the list of modifications:
1. Added new 2x3 DFN 8-Lead package on
page 1.
2. Updated the Temperature Specifications table
with 2x3 DFN thermal resistance information.
3. Updated Section 1.1 “Test Circuits”.
4. Updated Figure 2-15.
5. Added the 2x3 DFN column to Table 3-1.
6. Added new Section 3.4 “Exposed Thermal
Pad (EP)”.
7. Updated Section 5.1 “SPICE Macro Model”.
8. Updated Section 5.5 “Analog Demonstration
and Evaluation Boards”.
9. Updated Section 5.6 “Application Notes”.
10. Updated Section 6.1 “Package Marking
Information” with the new 2x3 DFN package
marking information.
11. Updated the package drawings.
12. Updated the Product Identification System
section with new 2x3 DFN package information.
Revision H (May 2008)
The following is the list of modifications:
1. Design Aids: Name change for Mindi
Simulation Tool.
2. Package Types: Correct device labeling error.
3. Section 1.0 “Electrical Characteristics”, DC
Electrical Specifications: Changed “Maximum
Output Voltage Swing” condition from 0.9V Input
Overdrive to 0.5V Input Overdrive.
4. Section 1.0 “Electrical Characteristics”, AC
Electrical Specifications: Changed Phase
Margin condition from G = +1 to G= +1 V/V.
5. Section 5.0 “Design AIDS”: Name change for
Mindi Simulation Tool.
Revision G (November 2007)
The following is the list of modifications:
1. Updated notes to Section 1.0 “Electrical
Characteristics”.
2. Increased Absolute Maximum Voltage range at
input pins.
3. Increased maximum operating supply voltage
(V
DD
).
4. Added test circuits.
5. Added Figure 2-3 and Figure 2-20.
6. Added Section 4.1.1 “Phase Reversal”,
Section 4.1.2 “Input Voltage and Current
Limits”, Section 4.1.3 “Normal Operation”
and Section 4.5 “Unused Op Amps”.
7. Updated Section 5.0 “Design AIDS”,
8. Updated Section 6.0 “Packaging
Information”
9. Updated Package Outline Drawings.
Revision F (March 2005)
The following is the list of modifications:
1. Updated Section 6.0 “Packaging
Information” to include old and new packaging
examples.
Revision E (December 2004)
The following is the list of modifications:
1. V
OS
specification reduced to ±4.5 mV from
±7.0 mV for parts starting with date code
YYWW = 0449
2. Corrected package markings in Section 6.0
“Packaging Information”.
3. Added Appendix A: Revision History.
Revision D (May 2003)
• Undocumented changes.
Revision C (December 2002)
• Undocumented changes.
Revision B (October 2002)
• Undocumented changes.
Revision A (June 2002)
• Original data sheet release.