Datasheet

 2014 Microchip Technology Inc. DS20005284A-page 17
MCP2561/2FD
3.0 PACKAGING INFORMATION
3.1 Package Marking Information
8-Lead PDIP (300 mil)
Example:
8-Lead SOIC (150 mil)
Example:
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
* This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
Example:
8-Lead DFN (3x3 mm)
8-Lead PDIP (300 mil) Example:
XXXXXXXX
XXXXXNNN
YYWW
2561FD
E/P ^^256
1307
3
e
Part Number Code
MCP2561FD-E/MF DADY
MCP2561FDT-E/MF DADY
MCP2561FD-H/MF DADZ
MCP2561FDT-H/MF DADZ
MCP2562FD-E/MF DAEA
MCP2562FDT-E/MF DAEA
MCP2562FD-H/MF DAEB
MCP2562FDT-H/MF DAEB
DADY
1307
256
NNN
2561FDE
SN ^^1246
256
3
e
OR
2561FDH
SN ^^1246
256
3
e
OR
2561FD
H/P ^^256
1307
3
e