Datasheet

 2014 Microchip Technology Inc. DS20005284A-page 29
MCP2561/2FD
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact the factory or one of the sales offices listed on the back page.
PART NO. -X /XX
PackageTemperature
Range
Device
Device: MCP2561FD:High-Speed CAN Transceiver with SPLIT
MCP2561FDT:High-Speed CAN Transceiver with SPLIT
(Tape and Reel) (DFN and SOIC only)
MCP2562FD:High-Speed CAN Transceiver with V
IO
MCP2562FDT:High-Speed CAN Transceiver with VIO
(Tape and Reel) (DFN and SOIC only)
Temperature
Range:
E = -40°C to +125°C (Extended)
H = -40°C to +150°C (High)
Package: MF = Plastic Dual Flat, No Lead Package -
3x3x0.9 mm Body, 8-lead
P = Plastic Dual In-Line - 300 mil Body, 8-lead
SN = Plastic Small Outline - Narrow, 3.90 mm Body, 
8-lead
Examples:
a) MCP2561FD-E/MF:Extended Temperature,
8LD 3x3 DFN package.
b) MCP2561FDT-E/MF:Tape and Reel,
Extended Temperature,
8LD 3x3 DFN package.
c) MCP2561FD-E/P: Extended Temperature,
8LD PDIP package.
d) MCP2561FD-E/SN:Extended Temperature,
8LD SOIC package.
e) MCP2561FDT-E/SN:Tape and Reel,
Extended Temperature,
8LD SOIC package.
a) MCP2561FD-H/MF:High Temperature,
8LD 3x3 DFN package.
b) MCP2561FDT-H/MF:Tape and Reel,
High Temperature,
8LD 3x3 DFN package.
c) MCP2561FD-H/P: High Temperature,
8LD PDIP package.
d) MCP2561FD-H/SN:High Temperature,
8LD SOIC package.
e) MCP2561FDT-H/SN:Tape and Reel,
High Temperature,
8LD SOIC package.