Datasheet
Table Of Contents
- Features
- Package Types
- Block Diagram
- 1.0 Device Overview
- 2.0 Electrical Characteristics
- 2.1 Terms and Definitions
- 2.1.1 Bus Voltage
- 2.1.2 Common Mode Bus Voltage Range
- 2.1.3 Differential Internal Capacitance, Cdiff (of a CAN node)
- 2.1.4 Differential Internal Resistance, Rdiff (of a CAN node)
- 2.1.5 Differential Voltage, Vdiff (of CAN bus)
- 2.1.6 Internal Capacitance, Cin (of a CAN node)
- 2.1.7 Internal Resistance, Rin (of a CAN node)
- FIGURE 2-1: Physical Layer Definitions
- Absolute Maximum Ratings†
- 2.2 DC Characteristics
- 2.3 AC Characteristics
- 2.4 Timing Diagrams and Specifications
- 2.1 Terms and Definitions
- 3.0 Packaging Information
- Product Identification System
- Appendix A: Revision History
- Worldwide Sales and Service
© 2007 Microchip Technology Inc. DS21667E-page 17
MCP2551
8-Lead Plastic Small Outline (SN) – Narrow, 3.90 mm Body [SOIC]
N
otes:
1
. Pin 1 visual index feature may vary, but must be located within the hatched area.
2
. § Significant Characteristic.
3
. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4
. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units MILLMETERS
Dimension Limits MIN NOM MAX
Number of Pins N 8
Pitch e 1.27 BSC
Overall Height A – – 1.75
Molded Package Thickness A2 1.25 – –
Standoff
§
A1 0.10 – 0.25
Overall Width E 6.00 BSC
Molded Package Width E1 3.90 BSC
Overall Length D 4.90 BSC
Chamfer (optional) h 0.25 – 0.50
Foot Length L 0.40 – 1.27
Footprint L1 1.04 REF
Foot Angle φ 0° – 8°
Lead Thickness c 0.17 – 0.25
Lead Width b 0.31 – 0.51
Mold Draft Angle Top α 5° – 15°
Mold Draft Angle Bottom β 5° – 15°
D
N
e
E
E1
NOTE 1
12 3
b
A
A1
A2
L
L1
c
h
h
φ
β
α
Microchip Technology Drawing C04-057
B