Datasheet
Table Of Contents
- Features
- Package Types
- Block Diagram
- 1.0 Device Overview
- 2.0 Electrical Characteristics
- 2.1 Terms and Definitions
- 2.1.1 Bus Voltage
- 2.1.2 Common Mode Bus Voltage Range
- 2.1.3 Differential Internal Capacitance, Cdiff (of a CAN node)
- 2.1.4 Differential Internal Resistance, Rdiff (of a CAN node)
- 2.1.5 Differential Voltage, Vdiff (of CAN bus)
- 2.1.6 Internal Capacitance, Cin (of a CAN node)
- 2.1.7 Internal Resistance, Rin (of a CAN node)
- FIGURE 2-1: Physical Layer Definitions
- Absolute Maximum Ratings†
- 2.2 DC Characteristics
- 2.3 AC Characteristics
- 2.4 Timing Diagrams and Specifications
- 2.1 Terms and Definitions
- 3.0 Packaging Information
- Product Identification System
- Appendix A: Revision History
- Worldwide Sales and Service
MCP2551
DS21667E-page 16 © 2007 Microchip Technology Inc.
8-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]
N
otes:
1
. Pin 1 visual index feature may vary, but must be located with the hatched area.
2
. § Significant Characteristic.
3
. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4
. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units INCHES
Dimension Limits MIN NOM MAX
Number of Pins N 8
Pitch e .100 BSC
Top to Seating Plane A – – .210
Molded Package Thickness A2 .115 .130 .195
Base to Seating Plane A1 .015 – –
Shoulder to Shoulder Width E .290 .310 .325
Molded Package Width E1 .240 .250 .280
Overall Length D .348 .365 .400
Tip to Seating Plane L .115 .130 .150
Lead Thickness c .008 .010 .015
Upper Lead Width b1 .040 .060 .070
Lower Lead Width b .014 .018 .022
Overall Row Spacing § eB – – .430
N
E1
NOTE 1
D
12
3
A
A1
A2
L
b1
b
e
E
eB
c
Microchip Technology Drawing C04-018
B