Datasheet
Table Of Contents
- Features
- Package Types
- Block Diagram
- 1.0 Device Overview
- 2.0 Electrical Characteristics
- 2.1 Terms and Definitions
- 2.1.1 Bus Voltage
- 2.1.2 Common Mode Bus Voltage Range
- 2.1.3 Differential Internal Capacitance, Cdiff (of a CAN node)
- 2.1.4 Differential Internal Resistance, Rdiff (of a CAN node)
- 2.1.5 Differential Voltage, Vdiff (of CAN bus)
- 2.1.6 Internal Capacitance, Cin (of a CAN node)
- 2.1.7 Internal Resistance, Rin (of a CAN node)
- FIGURE 2-1: Physical Layer Definitions
- Absolute Maximum Ratings†
- 2.2 DC Characteristics
- 2.3 AC Characteristics
- 2.4 Timing Diagrams and Specifications
- 2.1 Terms and Definitions
- 3.0 Packaging Information
- Product Identification System
- Appendix A: Revision History
- Worldwide Sales and Service
© 2007 Microchip Technology Inc. DS21667E-page 15
MCP2551
3.0 PACKAGING INFORMATION
3.1 Package Marking Information
XXXXXXXX
XXXXXNNN
YYWW
8-Lead PDIP (300 mil)
Example:
8-Lead SOIC (150 mil)
Example:
XXXXXXXX
XXXXYYWW
NNN
MCP2551
I/P256
0726
MCP2551
I/SN0726
256
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
* This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
3
e
3
e