Datasheet

2005-2016 Microchip Technology Inc. DS20001952C-page 1
MCP23017/MCP23S17
Features
16-Bit Remote Bidirectional I/O Port:
- I/O pins default to input
High-Speed I
2
C Interface (MCP23017):
-100kHz
-400kHz
-1.7MHz
High-Speed SPI Interface (MCP23S17):
- 10 MHz (maximum)
Three Hardware Address Pins to Allow Up to
Eight Devices On the Bus
Configurable Interrupt Output Pins:
- Configurable as active-high, active-low or
open-drain
INTA and INTB Can Be Configured to Operate
Independently or Together
Configurable Interrupt Source:
- Interrupt-on-change from configured register
defaults or pin changes
Polarity Inversion Register to Configure the
Polarity of the Input Port Data
External Reset Input
Low Standby Current: 1 µA (max.)
Operating Voltage:
- 1.8V to 5.5V @ -40°C to +85°C
- 2.7V to 5.5V @ -40°C to +85°C
- 4.5V to 5.5V @ -40°C to +125°C
Packages
28-pin QFN, 6 x 6 mm Body
28-pin SOIC, Wide, 7.50 mm Body
28-pin SPDIP, 300 mil Body
28-pin SSOP, 5.30 mm Body
Package Types
2
3
4
5
6
1
7
V
SS
NC
15
16
17
18
19
20
21 GPA4
GPA3
GPA2
GPA1
GPA0
V
DD
INTB
SCK
SDA
NC
A0
A1
A2
RESET
232425262728 22
GPB3
GPB2
GPB1
GPB0
GPA7
GPA6
GPA5
10118 9 121314
GPB5
GPB6
GPB7
GPB4
INTA
GPB0
GPB1
GPB2
GPB3
INTA
GPB4
NC
NC
GPB5
GPB6
GPB7
SCK
GPA7
GPA6
GPA5
GPA4
GPA3
GPA2
GPA1
GPA0
V
DD
V
SS
A2
A1
A0
SDA
• 1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
INTB
RESET
EP
29 *
SPDIP
SSOP
SOIC
QFN
* Includes Exposed Thermal Pad; see Table 2-1.
2
3
4
5
6
1
7
V
SS
CS
15
16
17
18
19
20
21
GPA4
GPA3
GPA2
GPA1
GPA0
V
DD
INTB
SI
SO
A0
A1
A2
RESET
232425262728 22
GPB3
GPB2
GPB1
GPB0
GPA7
GPA6
GPA5
10118 9 121314
GPB5
GPB6
GPB7
GPB4
INTA
SCK
EP
29 *
GPB0
GPB1
GPB2
GPB3
INTA
GPB4
SO
CS
GPB5
GPB6
GPB7
SCK
GPA7
GPA6
GPA5
GPA4
GPA3
GPA2
GPA1
GPA0
V
DD
V
SS
A2
A1
A0
SI
• 1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
INTB
RESET
MCP23S17
MCP23017
16-Bit I/O Expander with Serial Interface

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