Datasheet

MCP2221
DS20005292A-page 62  2014 Microchip Technology Inc.
TABLE 4-2: THERMAL CONSIDERATIONS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40C  T
A  +85C (I-Temp)
Param.
No.
Sym. Characteristic Typ. Units Conditions
TH01 θ
JA Thermal Resistance Junction
to Ambient
70 C/W 14-pin PDIP package
95.3 C/W 14-pin SOIC package
100 C/W 14-pin TSSOP package
45.7 C/W 16-pin QFN 4 x 4 mm package
TH02 θ
JC Thermal Resistance Junction
to Case
32 C/W 14-pin PDIP package
31 C/W 14-pin SOIC package
24.4 C/W 14-pin TSSOP package
6.3 C/W 16-pin QFN 4 x 4 mm package
TH03 T
JMAX Maximum Junction Temperature +150 C
TH04 PD Power Dissipation — W PD = PINTERNAL + PI/O
TH05 PINTERNAL Internal Power Dissipation — W PINTERNAL = IDD x VDD
(1)
TH06 PI/O I/O Power Dissipation — W PI/O = (IOL x VOL) + (IOH x (VDD – VOH))
TH07 PDER Derated Power — W PDER = PDMAX (TJ – TA)/θJA
(2,3)
Note 1: IDD is the current to run the device alone without driving any load on the output pins.
2: T
A = Ambient Temperature.
3: T
J = Junction Temperature.