Datasheet

 2010 Microchip Technology Inc. DS22230A-page 15
MCP2003/4
2.4 Thermal Specifications
THERMAL CHARACTERISTICS
Parameter Symbol Typ Max Units Test Conditions
Recovery Temperature 
RECOVERY +140
—
C
Shutdown Temperature SHUTDOWN +150
—
C
Short Circuit Recovery Time t
THERM 1.5 5.0 ms
Thermal Package Resistances
Thermal Resistance, 8L-DFN JA 35.7 — C/W
Thermal Resistance, 8L-PDIP 
JA 89.3 — C/W
Thermal Resistance, 8L-SOIC JA 149.5 — C/W
Note 1: The maximum power dissipation is a function of TJMAX, JA and ambient temperature T
A
. The maximum
allowable power dissipation at an ambient temperature is P
D = (TJMAX - TA)JA. If this dissipation is
exceeded, the die temperature will rise above 150C and the MCP2003/4 will go into thermal shutdown.