Datasheet

ManualsBrandsMicrochip ManualsIntegrated Circuits (ICs)LIN Transceiver 400 mV SOIC

 2010 Microchip Technology Inc. DS22230A-page 1

MCP2003/4

Features

• The MCP2003 and MCP2004 are compliant with

LIN Bus Specifications 1.3, 2.0 and 2.1 and are

compliant to SAE J2602

• Support Baud Rates up to 20 Kbaudwith

LIN-compatible output driver

• 43V load dump protected

• Very low EMI meets stringent OEM requirements

• Very high ESD immunity:

- >20kV on VBB (IEC 61000-4-2)

- >14kV on LBUS (IEC 61000-4-2)

• Very high immunity to RF disturbances meets

stringent OEM requirements

• Wide supply voltage, 6.0V-27.0V continuous

• Extended Temperature Range: -40 to +125°C

• Interface to PIC

MCU EUSART and standard

USARTs

• Local Interconnect Network (LIN) bus pin:

- Internal pull-up resistor and diode

- Protected against battery shorts

- Protected against loss of ground

- High current drive

• Automatic thermal shutdown

• Low-power mode:

- Receiver monitoring bus and transmitter off,

(

 5µA)

Description

This device provides a bidirectional, half-duplex

communication physical interface to automotive and

industrial LIN systems to meet the LIN bus specification

Revision 2.1 and SAE J2602. The device is short circuit

and overtemperature protected by internal circuitry.

The device has been specifically designed to operate in

the automotive operating environment and will survive

all specified transient conditions while meeting all of the

stringent quiescent current requirements.

MCP200X family members:

• 8-pin PDIP, DFN and SOIC packages:

- MCP2003, LIN-compatible driver, with WAKE

pins

- MCP2004, LIN-compatible driver, with

FAULT

/TXE pins

Package Types

MCP2004

PDIP, SOIC

FAULT/TXE

VBB

LBUS

VSS

VRENRXD

MCP2003

PDIP, SOIC

WAKE

VBB

LBUS

VSS

VRENRXD

MCP2003

4x4 DFN*

WAKE

VBB

LBUS

VSS

VRENRXD

MCP2004

4x4 DFN*

FAULT/TXE

VBB

LBUS

VSS

VRENRXD

* Includes Exposed Thermal Pad (EP); see Table 1-1.

LIN J2602 Transceiver

Summary of content (32 pages)

PAGE 1
MCP2003/4 LIN J2602 Transceiver Features Description • The MCP2003 and MCP2004 are compliant with LIN Bus Specifications 1.3, 2.0 and 2.1 and are compliant to SAE J2602 • Support Baud Rates up to 20 Kbaudwith LIN-compatible output driver • 43V load dump protected • Very low EMI meets stringent OEM requirements • Very high ESD immunity: - >20kV on VBB (IEC 61000-4-2) - >14kV on LBUS (IEC 61000-4-2) • Very high immunity to RF disturbances meets stringent OEM requirements • Wide supply voltage, 6.0V-27.
PAGE 2
MCP2003/4 MCP2003 Block Diagram VREN VBB Ratiometric Reference WAKE Wake-Up Logic and Power Control RXD CS TXD ~30 k LBUS OC VSS Thermal Protection Short Circuit Protection MCP2004 Block Diagram VREN VBB Ratiometric Reference Wake-Up Logic and Power Control RXD CS ~30 k TXD LBUS OC FAULT/TXE VSS Thermal Protection DS22230A-page 2 Short Circuit Protection  2010 Microchip Technology Inc.
PAGE 3
MCP2003/4 1.0 DEVICE OVERVIEW 1.2.3 THERMAL PROTECTION The MCP2003/4 provides a physical interface between a microcontroller and a LIN bus. This device will translate the CMOS/TTL logic levels to LIN logic level, and vice versa. It is intended for automotive and industrial applications with serial bus speeds up to 20 Kbaud. The thermal protection circuit monitors the die temperature and is able to shut down the LIN transmitter. LIN specification 2.
PAGE 4
MCP2003/4 1.3 Modes of Operation the TXD pin is held low when CS goes high, the device will transition to Transmitter Off mode instead of Operation mode. For an overview of all operational modes, refer to Table 1-1. 1.3.1 1.3.3 POWER-DOWN MODE In Power Down mode, the transmitter and VREN are both off. Only the receiver section and the wake-up circuits are operational. This is the lowest power mode. The MCP2003/4 will go into the Power Down mode on the falling edge of CS.
PAGE 5
MCP2003/4 FIGURE 1-3: OPERATIONAL MODES STATE DIAGRAM – MCP2004 Ready Mode POR VREN OFF RX OFF TX OFF VBB > 5.
PAGE 6
MCP2003/4 1.4 Typical Applications EXAMPLE 1-1: TYPICAL MCP2003 APPLICATION +12 +12 50 43V 1.0 µF (See Note) Master Node Only +12 220 K VOLTAGE REG VDD VBB VREN TXD TXD RXD RXD I/O CS 1 K LIN Bus LBUS 27V WAKE Wake-up 100 nF Note: VSS For applications with current requirements of less than 20 mA, the connection to +12V can be deleted, and voltage to the regulator supplied directly from the VREN pin. EXAMPLE 1-2: TYPICAL MCP2004 APPLICATION +12 +12 50 43V Wake-up 1.
PAGE 7
MCP2003/4 EXAMPLE 1-3: TYPICAL LIN NETWORK CONFIGURATION 40m + Return LIN bus 1 k VBB LIN bus MCP200X LIN bus MCP200X Slave 1 µC LIN bus MCP200X LIN bus MCP200X Slave 2 µC Slave n <23 µC Master µC  2010 Microchip Technology Inc.
PAGE 8
MCP2003/4 1.
PAGE 9
MCP2003/4 TABLE 1-2: FAULT/TXE TRUTH TABLE FAULT/TXE TXD In RXD Out LINBUS I/O Thermal Override L H VBB H H L External Input Driven Output Definition OFF H L FAULT, TXD driven low, LINBUS shorted to VBB (Note 1) VBB OFF H H OK L GND OFF H H OK H L GND OFF H H OK, data is being received from the LINBUS x x VBB ON H L FAULT, Transceiver in thermal shutdown x x VBB x L x NO FAULT, the CPU is commanding the transceiver to turn off the transmitter driver Legend:
PAGE 10
MCP2003/4 NOTES: DS22230A-page 10  2010 Microchip Technology Inc.
PAGE 11
MCP2003/4 2.0 ELECTRICAL CHARACTERISTICS 2.1 Absolute Maximum Ratings† VIN DC Voltage on RXD, TXD, FAULT/TXE .....................................................................................................-0.3 to +30V VIN DC Voltage on CS, WAKE and VREN .......................................................................................................-0.3 to +30V VBB Battery Voltage, continuous .....................................................................................................
PAGE 12
MCP2003/4 2.2 DC Specifications DC Specifications Parameter Electrical Characteristics: Unless otherwise indicated, all limits are specified for: VBB = 6.0V to 27.0V TA = -40°C to +125°C Sym Min. Typ. Max.
PAGE 13
MCP2003/4 2.2 DC Specifications (Continued) DC Specifications Electrical Characteristics: Unless otherwise indicated, all limits are specified for: VBB = 6.0V to 27.0V TA = -40°C to +125°C Parameter Sym Min. Typ. Max. Units Conditions High Level Input Voltage VIH(LBUS) 0.6 VBB — 18 V Recessive state Low Level Input Voltage VIL(LBUS) -8 — 0.4 VBB V Dominant state VHYS — — 0.175 VBB V Low Level Output Current IOL(LBUS) 40 — 200 mA Output voltage = 0.
PAGE 14
MCP2003/4 2.3 AC Specifications AC CHARACTERISTICS Parameter VBB = 6.0V to 27.0V; TA = -40°C to +125°C Sym Min. Typ. Max. Units Test Conditions Bus Interface – Constant Slope Time Parameters tslope 3.5 — 22.5 µs 7.3V <= VBB <= 18V Propagation Delay of Transmitter ttranspd — — 4.0 µs ttranspd = max (ttranspdr or ttranspdf) Propagation Delay of Receiver trecpd — — 6.0 µs trecpd = max (trecpdr or trecpdf) Symmetry of Propagation Delay of Receiver rising edge w.r.t.
PAGE 15
MCP2003/4 2.4 Thermal Specifications THERMAL CHARACTERISTICS Parameter Symbol Typ Max Units Recovery Temperature RECOVERY +140 — C Shutdown Temperature SHUTDOWN +150 — C tTHERM 1.5 5.0 ms Short Circuit Recovery Time Test Conditions Thermal Package Resistances Thermal Resistance, 8L-DFN JA 35.7 — C/W Thermal Resistance, 8L-PDIP JA 89.3 — C/W Thermal Resistance, 8L-SOIC JA 149.
PAGE 16
MCP2003/4 2.5 Typical Performance Curves Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, VBB = 6.
PAGE 17
MCP2003/4 2.6 Timing Diagrams and Specifications FIGURE 2-4: BUS TIMING DIAGRAM TXD 50% 50% LBUS .95VLBUS .50VBB 0.5VLBUS TTRANSPDR TTRANSPDF TRECPDF 0.0V TRECPDR RXD 50% Internal TXD/RXD Compare Match 50% Match Match Match Match FAULT Sampling TFAULT TFAULT FAULT/TXE Output Stable FIGURE 2-5: Hold Value Stable Hold Value Stable CS TO VREN TIMING DIAGRAM CS TCSOR VBB VREN OFF TCSPD FIGURE 2-6: BUS TO VREN WAKE TIMING DIAGRAM LBUS .
PAGE 18
MCP2003/4 NOTES: DS22230A-page 18  2010 Microchip Technology Inc.
PAGE 19
MCP2003/4 3.0 PACKAGING INFORMATION 3.1 Package Marking Information 8-Lead DFN (4x4) XXXXXX XXXXXX YYWW NNN 2004 e3 E/MD^^ 0948 256 8-Lead PDIP (300 mil) 8-Lead SOIC (150 mil) Legend: XX...
PAGE 20
MCP2003/4 8-Lead Plastic Dual Flat, No Lead Package (MD) – 4x4x0.9 mm Body [DFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Microchip Technology Drawing C04-131E Sheet 1 of 2 DS22230A-page 20  2010 Microchip Technology Inc.
PAGE 21
MCP2003/4 8-Lead Plastic Dual Flat, No Lead Package (MD) – 4x4x0.9 mm Body [DFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Microchip Technology Drawing C04-131E Sheet 2 of 2  2010 Microchip Technology Inc.
PAGE 22
MCP2003/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS22230A-page 22  2010 Microchip Technology Inc.
PAGE 23
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PAGE 24
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PAGE 25
MCP2003/4 ! "" #$ %& ! ' 3 & ' !& " & 4 # * !( ! ! & 4 % & & # & && 255*** ' '5 4  2010 Microchip Technology Inc.
PAGE 26
MCP2003/4 NOTES: DS22230A-page 26  2010 Microchip Technology Inc.
PAGE 27
MCP2003/4 APPENDIX A: REVISION HISTORY Revision A (March 2010) • Original Release of this Document.  2010 Microchip Technology Inc.
PAGE 28
MCP2003/4 NOTES: DS22230A-page 28  2010 Microchip Technology Inc.
PAGE 29
MCP2003/4 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO.
PAGE 30
MCP2003/4 NOTES: DS22230A-page 30  2010 Microchip Technology Inc.
PAGE 31
Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature.
PAGE 32
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