Datasheet

© 2007 Microchip Technology Inc. DS22001C-page 25
MCP1827/MCP1827S
5-Lead Plastic (ET) [DDPAK]
Notes:
1. § Significant Characteristic.
2. Dimensions D and E do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units INCHES
Dimension Limits MIN NOM MAX
Number of Pins N 5
Pitch e .067 BSC
Overall Height A .160 – .190
Standoff § A1 .000 – .010
Overall Width E .380 – .420
Exposed Pad Width E1 .245 – –
Molded Package Length D .330 – .380
Overall Length H .549 – .625
Exposed Pad Length D1 .270 – –
Lead Thickness c .014 – .029
Pad Thickness C2 .045 – .065
Lead Width b .020 – .039
Foot Length L .068 – .110
Pad Length L1 – – .067
Foot Angle φ 0° – 8°
E
L1
D
D1
H
N
1
b
e
TOP VIEW
BOTTOM VIEW
A
A1
c
L
C2
CHAMFER
OPTIONAL
E1
φ
Microchip Technology Drawing C04-012B