Datasheet

MCP1827/MCP1827S
DS22001C-page 24 © 2007 Microchip Technology Inc.
3-Lead Plastic Transistor Outline (AB) [TO-220]
Notes:
1. Dimensions D and E do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" per side.
2. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units INCHES
Dimension Limits MIN NOM MAX
Number of Pins N 3
Pitch e .100 BSC
Overall Pin Pitch e1 .200 BSC
Overall Height A .140 – .190
Tab Thickness A1 .020 – .055
Base to Lead A2 .080 – .115
Overall Width E .357 – .420
Mounting Hole Center Q .100 – .120
Overall Length D .560 – .650
Molded Package Length D1 .330 – .355
Tab Length H1 .230 – .270
Mounting Hole Diameter φP .139 – .156
Lead Length L .500 – .580
Lead Shoulder L1 – – .250
Lead Thickness c .012 – .024
Lead Width b .015 .027 .040
Shoulder Width b2 .045 .057 .070
E
Q
D
D1
L1
L
1
2
e
e1
b
b2
N
A2
c
H1
A1
A
P
CHAMFER
OPTIONAL
φ
Microchip Technology Drawing C04-034B