Datasheet

2007-2013 Microchip Technology Inc. DS22057B-page 9
MCP1826/MCP1826S
TEMPERATURE SPECIFICATIONS
Power Supply Ripple Rejection
Ratio
PSRR 60 dB f = 100 Hz, C
OUT
= 4.7 µF,
I
OUT
= 100 µA,
V
INAC
= 100 mV pk-pk,
C
IN
= 0 µF
Thermal Shutdown Temperature T
SD
—150—°CI
OUT
= 100 µA, V
OUT
= 1.8V,
V
IN
= 2.8V
Thermal Shutdown Hysteresis T
SD
—10—°CI
OUT
= 100 µA, V
OUT
= 1.8V,
V
IN
= 2.8V
Parameters Sym. Min. Typ. Max. Units Conditions
Temperature Ranges
Operating Junction Temperature Range T
J
-40 +125 °C Steady State
Maximum Junction Temperature T
J
+150 °C Transient
Storage Temperature Range T
A
-65 +150 °C
Thermal Package Resistances
Thermal Resistance, 3L-DDPAK
JA
31.4 °C/W 4-Layer JC51 Standard
Board
JC
—3.0—°C/W
Thermal Resistance, 3L-TO-220
JA
29.4 °C/W 4-Layer JC51 Standard
Board
JC
—2.0—°C/W
Thermal Resistance, 3L-SOT-223
JA
62 °C/W EIA/JEDEC JESD51-751-7
4 Layer Board
JC
—15.0— °C/W
Thermal Resistance, 5L-DDPAK
JA
31.2 °C/W 4-Layer JC51 Standard
Board
JC
—3.0—°C/W
Thermal Resistance, 5L-TO-220
JA
29.3 °C/W 4-Layer JC51 Standard
Board
JC
—2.0—°C/W
Thermal Resistance, 5L-SOT-223
JA
62 °C/W EIA/JEDEC JESD51-751-7
4 Layer Board
JC
—15.0— °C/W
AC/DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise noted, V
IN
= V
OUT(MAX)
+ V
DROPOUT(MAX)
, Note 1, V
R
=1.8V for Adjustable Output,
I
OUT
= 1 mA, C
IN
= C
OUT
= 4.7 µF (X7R Ceramic), T
A
= +25°C.
Boldface type applies for junction temperatures, T
J
(Note 7) of -40°C to +125°C
Parameters Sym. Min. Typ. Max. Units Conditions
Note 1: The minimum V
IN
must meet two conditions: V
IN
2.3V and V
IN
V
OUT(MAX)
V
DROPOUT(MAX).
2: V
R
is the nominal regulator output voltage for the fixed cases. V
R
= 1.2V, 1.8V, etc. V
R
is the desired set point output
voltage for the adjustable cases. V
R
= V
ADJ
*
((R
1
/R
2
)+1). Figure 4-1.
3: TCV
OUT
= (V
OUT-HIGH
– V
OUT-LOW
) *10
6
/ (V
R
* Temperature). V
OUT-HIGH
is the highest voltage measured over the
temperature range. V
OUT-LOW
is the lowest voltage measured over the temperature range.
4: Load regulation is measured at a constant junction temperature using low duty-cycle pulse testing. Load regulation is
tested over a load range from 1 mA to the maximum specified output current.
5: Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its
nominal value that was measured with an input voltage of V
IN
= V
OUT(MAX)
+ V
DROPOUT(MAX)
.
6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction to air. (i.e., T
A
, T
J
,
JA
). Exceeding the maximum allowable power
dissipation will cause the device operating junction temperature to exceed the maximum +150°C rating. Sustained
junction temperatures above 150°C can impact device reliability.
7: The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the
desired junction temperature. The test time is small enough such that the rise in the junction temperature over the
ambient temperature is not significant.