Datasheet

2007 Microchip Technology Inc. DS22070A-page 9
MCP1824/MCP1824S
Detect Threshold to PWRGD
Active Time Delay
T
VDET-PWRGD
— 200 — µs V
OUT
= V
PWRGD_TH
+ 50 mV
to V
PWRGD_TH
- 50 mV
Shutdown Input
Logic High Input V
SHDN-HIGH
45 ——%V
IN
V
IN
= 2.1V to 6.0V
Logic Low Input V
SHDN-LOW
——15 %V
IN
V
IN
= 2.1V to 6.0V
SHDN
Input Leakage Current SHDN
ILK
-0.1 ±0.001 +0.1 µA V
IN
=6V, SHDN =V
IN
,
SHDN
= GND
AC Performance
Output Delay From SHDN
T
OR
— 100 — µs SHDN = GND to V
IN
,
V
OUT
= GND to 95% V
R
Output Noise e
N
—2.0—µV/√Hz I
OUT
= 200 mA, f = 1 kHz,
C
OUT
= 10 µF (X7R Ceramic),
V
OUT
= 2.5V
Power Supply Ripple Rejection
Ratio
PSRR — 55 — dB f = 100 Hz,
I
OUT
= 10 mA,
V
INAC
= 200 mV pk-pk,
C
IN
= 0 µF
Thermal Shutdown Temperature T
SD
— 150 — °C I
OUT
= 100 µA, V
OUT
= 1.8V,
V
IN
= 2.8V
Thermal Shutdown Hysteresis ΔT
SD
—10—°CI
OUT
= 100 µA, V
OUT
= 1.8V,
V
IN
= 2.8V
AC/DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise noted, V
IN
= V
OUT(MAX)
+ V
DROPOUT(MAX)
, Note 1, V
R
= 1.8V for Adjustable Output,
I
OUT
= 1 mA, C
IN
= C
OUT
= 4.7 µF (X7R Ceramic), T
A
= +25°C.
Boldface type applies for junction temperatures, T
J
(Note 7) of -40°C to +125°C
Parameters Sym Min Typ Max Units Conditions
Note 1: The minimum V
IN
must meet two conditions: V
IN
≥ 2.1V and V
IN
≥ V
OUT(MAX)
+ V
DROPOUT(MAX).
2: V
R
is the nominal regulator output voltage for the fixed cases. V
R
= 1.2V, 1.8V, etc. V
R
is the desired set point output
voltage for the adjustable cases. V
R
= V
ADJ *
((R
1
/R
2
)+1). Figure 4-1.
3: TCV
OUT
= (V
OUT-HIGH
– V
OUT-LOW
) *10
6
/ (V
R
* ΔTemperature). V
OUT-HIGH
is the highest voltage measured over the
temperature range. V
OUT-LOW
is the lowest voltage measured over the temperature range.
4: Load regulation is measured at a constant junction temperature using low duty-cycle pulse testing. Load regulation is
tested over a load range from 1 mA to the maximum specified output current.
5: Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its
nominal value that was measured with an input voltage of V
IN
= V
OUT(MAX)
+ V
DROPOUT(MAX)
.
6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction to air. (i.e., T
A
, T
J
, θ
JA
). Exceeding the maximum allowable power
dissipation will cause the device operating junction temperature to exceed the maximum +150°C rating. Sustained
junction temperatures above 150°C can impact device reliability.
7: The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the
desired junction temperature. The test time is small enough such that the rise in the junction temperature over the
ambient temperature is not significant.