Datasheet

 2012 Microchip Technology Inc. DS25160A-page 5
MCP1755/1755S
1.0 ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
Input Voltage, V
IN
.........................................................+17.6V
V
IN
, PWRGD, SHDN................. (GND – 0.3V) to (V
IN
+0.3V)
V
OUT
................................................. (GND – 0.3V) to (+5.5V)
Internal Power Dissipation ............ Internally-Limited (Note 6)
Output Short Circuit Current ................................. Continuous
Storage temperature .....................................-55°C to +150°C
Maximum Junction Temperature ....................+165°C(Note 7)
Operating Junction Temperature...................-40°C to +150°C
ESD protection on all pins kV HBM and 400V MM
† Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of
the device at those or any other conditions above those
indicated in the operational listings of this specification
is not implied. Exposure to maximum rating conditions
for extended periods may affect device reliability.
AC/DC CHARACTERISTICS
Electrical Specifications: Unless otherwise specified, all limits are established for V
IN
=V
R
+1V, Note 1,
I
LOAD
=1mA, C
OUT
= 1 µF (X7R), C
IN
= 1 µF (X7R), T
A
=+25°C, t
r(VIN)
= 0.5 V/µs, SHDN =V
IN
,
PWRGD = 10K to V
OUT
. Boldface type applies for junction temperatures, T
J
(Note 7) of -40°C to +125°C.
Parameters Sym. Min. Typ. Max. Units Conditions
Input/Output Characteristics
Input Operating Voltage V
IN
3.6 — 16.0 V
Output Voltage Operating
Range
V
OUT-RANGE
1.8 — 5.5 V
Input Quiescent Current I
q
—68100 µA I
L
=0mA
Input Quiescent Current
for SHDN
mode
I
SHDN
—0.14 µA SHDN =GND
Ground Current I
GND
—300400 µA I
LOAD
= 300 mA
Maximum Output Current I
OUT_mA
300 ——mA
Output Soft Current Limit SCL — 450 — mA V
OUT
 0.1V,
V
IN
=V
IN(MIN)
,
Current measured 10 ms after
the load is applied
Output Pulse Current Limit PCL — 350 — mA Pulse Duration < 100 ms,
Duty Cycle < 50%,
V
OUT
 0.1V, Note 6
Output Short Circuit
Foldback Current
I
OUT_SC
—30—mAV
IN
=V
IN(MIN)
,
V
OUT
=GND
Output Voltage Overshoot
on Start-up
V
OVER
—0.5—%V
OUT
V
IN
=0 to 16V,
I
LOAD
= 300 mA
Note 1: The minimum V
IN
must meet two conditions: V
IN
 3.6V and V
IN
 V
R
+ V
DROPOUT(MAX)
.
2: V
R
is the nominal regulator output voltage when the input voltage V
IN
=V
Rated
+V
DROPOUT(MAX)
or V
IN
= 3.6V (whichever is
greater); I
OUT
=1mA.
3: TCV
OUT
=(V
OUT-HIGH
–V
OUT-LOW
)x10
6
/(V
R
x 
Temperature
), V
OUT-HIGH
= highest voltage measured over the temperature
range. V
OUT-LOW
= lowest voltage measured over the temperature range.
4: Load regulation is measured at a constant junction temperature using low duty-cycle pulse testing. Changes in output
voltage due to heating effects are determined using thermal regulation specification TCV
OUT
.
5: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below the output voltage
value that was measured with an applied input voltage of V
IN
=V
R
+1V or V
IN
= 3.6V (whichever is greater).
6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction to air (i.e., T
A
, T
J
, 
JA
). Exceeding the maximum allowable power
dissipation will cause the device operating junction temperature to exceed the maximum +150°C rating. Sustained junction
temperatures above +150°C can impact the device reliability.
7: The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the desired
junction temperature. The test time is small enough such that the rise in the junction temperature over the ambient
temperature is not significant.
8: See Section 4.6 “Shutdown Input (SHDN)” and Figure 2-34.