Datasheet

© 2011 Microchip Technology Inc. DS22049F-page 27
MCP1703
APPENDIX A: REVISION HISTORY
Revision F (February 2011)
The following is the list of modifications:
1. Added a new line to Output Voltage Regulation
in the DC Characteristics table.
2. Added Figure 2-30 and Figure 2-31.
3. Added a new line to the Tolerance field in the
Product Identification System section.
4. Added a new custom part to the Standard
Options for SOT-223 table in the Package
Marking Information section.
Revision E (November 2010)
The following is the list of modifications:
1. Updated the Thermal Resistance Typical value
for the SOT-89 package in the Junction
Temperature Estimate section.
Revision D (September 2009)
The following is the list of modifications:
1. Added the 8-Lead 2x3 DFN package.
2. Updated the Temperature Specification table.
3. Updated Table 3- 1.
4. Added Section 3.4 “Exposed Thermal Pad
(EP)”.
5. Updated the Package Outline Drawings and the
information for the 8-Lead 2x3 DFN package.
6. Added the information for the 8-Lead 2x3 DFN
package in the Product Identification System
section.
Revision C (June 2009)
The following is the list of modifications:
1. Absolute Maximum Ratings: Updated this
section.
2. DC Characteristics table: Updated.
3. Temperature Specifications table: Updated.
4. Package Information: Update Package Outline
Drawings.
Revision B (February 2008)
The following is the list of modifications:
1. Updated Temperature Specifications table.
2. Updated Table 3- 1.
3. Updated Section 5.2 “Output”.
4. Added SOT-223 Landing Pattern Outline
drawing.
Revision A (June 2007)
• Original Release of this Document.