Datasheet

 2010 Microchip Technology Inc. DS22008E-page 5
MCP1702
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters Sym Min Typ Max Units Conditions
Temperature Ranges
Operating Junction Temperature Range T
J
-40 +125 °C Steady State
Maximum Junction Temperature T
J
— +150 °C Transient
Storage Temperature Range T
A
-65 +150 °C
Thermal Package Resistance (Note 2)
Thermal Resistance, 3L-SOT-23A

JA
— 336 — °C/W
EIA/JEDEC JESD51-7
FR-4 0.063 4-Layer Board

JC
—110—°C/W
Thermal Resistance, 3L-SOT-89

JA
— 153.3 — °C/W
EIA/JEDEC JESD51-7
FR-4 0.063 4-Layer Board

JC
— 100 — °C/W
Thermal Resistance, 3L-TO-92 
JA
— 131.9 — °C/W

JC
— 66.3 — °C/W
Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction to air (i.e., T
A
, T
J
, 
JA
). Exceeding the maximum allowable power
dissipation will cause the device operating junction temperature to exceed the maximum 150°C rating. Sustained
junction temperatures above 150°C can impact the device reliability.
2: Thermal Resistance values are subject to change. Please visit the Microchip web site for the latest packaging
information.