Datasheet

 2005-2018 Microchip Technology Inc. DS20001826E-page 5
MCP1700
Thermal Resistance, TO-92 
JA
—92—°C/W
EIA/JEDEC JESD51-7
FR-4 4-Layer Board

JC(Top)
—74—°C/W
TEMPERATURE SPECIFICATIONS (CONTINUED)
Electrical Characteristics: Unless otherwise specified, all limits are established for V
IN
=V
R
+1V, I
LOAD
= 100 µA,
C
OUT
=1µF (X7R), C
IN
=1µF (X7R), T
A
= +25°C.
Boldface type applies for junction temperatures, T
J
(Note 1) of -40°C to +125°C.
Parameters Sym. Min. Typ. Max. Units Conditions
Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction to air (i.e. T
A
, T
J
, 
JA
). Exceeding the maximum allowable power
dissipation will cause the device operating junction temperature to exceed the maximum 150°C rating. Sustained
junction temperatures above 150°C can impact the device reliability.