Datasheet

 2014 Microchip Technology Inc. DS20005308B-page 25
MCP16331
FIGURE 5-3: MCP16331 TDFN-8 Recommended Layout Design.
C
B
V
OUT
V
IN
C
OUT
SW
BOOST
GND
EN
FB
L
V
IN
D
B
D1
3.3V
4V to 50V
Component Value
C
IN
2x10 µF
C
OUT
2x10 µF
L22 µH
R
TOP
31.2 k
R
BOT
10 k
D1 MBRS1100
D
B
1N4148WS
C
B
100 nF
C
TOP
20 pF
C
SNUB
430 pF
R
SNUB
680
MCP16331
7
1
6
5
8
2
R
BOT
C
IN
R
TOP
C
TOP
R
SNUB
C
SNUB
C
IN
C
OUT
L
D1
R
BOT
R
TOP
MCP16331
C
SNUB
R
SNUB
C
B
D
B
V
IN
GND
V
OUT
Note: Red represents top layer pads and traces and blue
represents bottom layer pads and traces. On the
bottom layer, a GND plane should be placed, which
is not represented in the example above for visibility
reasons.
Optional