Datasheet

 2004-2014 Microchip Technology Inc. DS20001906D-page 23
MCP102/103/121/131
APPENDIX A: REVISION HISTORY
Revision D (February 2014)
The following is the list of modifications:
1. Updated Ta ble 3 -1.
2. Updated Figure 2-25.
3. Updated SC70, SOT-23 and TO-92 package
drawings and markings in Section 5.0
“Packaging Information”.
Revision C (January 2013)
• Added a note to each package outline drawing.
Revision B (March 2005)
The following is the list of modifications:
1. Added Section 4.4 “Usage in PIC®
Microcontroller, ICSP™ Applications
(MCP121 only)” on using the MCP121 in PIC
microcontroller ICSP applications.
2. Added V
ODH
specifications in Section 1.0
“Electrical Characteristics” (for ICSP
applications).
3. Added Figure 2-23.
4. Updated SC70 package markings and added
Pb-free marking information to Section 5.0
“Packaging Information”.
5. Added Appendix A: “Revision History”.
Revision A (August 2004)
• Original Release of this Document.