Datasheet
LAN8740A/LAN8740Ai
DS00001987A-page 128 2013-2015 Microchip Technology Inc.
Microchip Technology Drawing C04-160B SQFN Sheet 2 of 2
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Number of Terminals
Overall Height
Terminal Width
Overall Width
Overall Length
Terminal Length
Exposed Pad Width
Exposed Pad Length
Terminal Thickness
Pitch
Standoff
Units
Dimension Limits
A1
A
b
D
E2
D2
A3
e
L
E
N
0.50 BSC
0.20 REF
3.20
0.35
0.18
0.80
0.00
0.25
5.00 BSC
0.40
3.30
0.90
0.02
5.00 BSC
MILLIMETERS
MIN
NOM
32
3.40
0.45
0.30
1.00
0.05
MAX
K-0.20 -
REF: Reference Dimension, usually without tolerance, for information purposes only.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
1.
2.
3.
Notes:
Pin 1 visual index feature may vary, but must be located within the hatched area.
Package is saw singulated
Dimensioning and tolerancing per ASME Y14.5M
Terminal-to-Exposed-Pad
32-Lead Very Thin Plastic Quad Flat, No Lead Package (MQ) - 5x5x0.9 mm Body [VQFN]
SMSC LEGACY SQFN
3.20 3.30 3.40