Datasheet

 2013-2015 Microchip Technology Inc. DS00001987A-page 113
LAN8740A/LAN8740Ai
5.0 OPERATIONAL CHARACTERISTICS
5.1 Absolute Maximum Ratings*
Supply Voltage (VDDIO, VDD1A, VDD2A) (see Note 1).......................................................................... -0.5 V to +3.6 V
Digital Core Supply Voltage (VDDCR) (see Note 1) ................................................................................ -0.5 V to +1.5 V
Ethernet Magnetics Supply Voltage ......................................................................................................... -0.5 V to +3.6 V
Positive voltage on input signal pins, with respect to ground (see Note 2) ............................................... VDDIO + 2.0 V
Negative voltage on input signal pins, with respect to ground (see Note 3) ............................................................-0.5 V
Positive voltage on XTAL1/CLKIN, with respect to ground .......................................................................................3.6 V
Storage Temperature ..............................................................................................................................-55
o
C to +150
o
C
Lead Temperature Range ........................................................................................... Refer to JEDEC Spec. J-STD-020
HBM ESD Performance ........................................................................................................................ .JEDEC Class 3A
Note 1: When powering this device from laboratory or system power supplies, it is important that the absolute max-
imum ratings not be exceeded or device failure can result. Some power supplies exhibit voltage spikes on
their outputs when AC power is switched on or off. In addition, voltage transients on the AC power line may
appear on the DC output. If this possibility exists, it is suggested that a clamp circuit be used.
2: This rating does not apply to the following pins: XTAL1/CLKIN, XTAL2, RBIAS.
3: This rating does not apply to the following pins: RBIAS.
*Stresses exceeding those listed in this section could cause permanent damage to the device. This is a stress rating
only. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Functional
operation of the device at any condition exceeding those indicated in Section 5.2, "Operating Conditions**" or any other
applicable section of this specification is not implied. Note, device signals are NOT 5.0 V tolerant unless specified oth-
erwise.
5.2 Operating Conditions**
Supply Voltage (VDDIO) ....................................................................................................................... +1.62 V to +3.6 V
Analog Port Supply Voltage (VDD1A, VDD2A)....................................................................................... +3.0 V to +3.6 V
Digital Core Supply Voltage (VDDCR) ................................................................................................ +1.14 V to +1.26 V
Ethernet Magnetics Supply Voltage ...................................................................................................... +2.25 V to +3.6 V
Ambient Operating Temperature in Still Air (T
A
)........................................................................................... (see Note 1)
Note 1: 0°C to +70°C for commercial version, -40°C to +85°C for industrial version.
**Proper operation of the device is guaranteed only within the ranges specified in this section. After the device has com-
pleted power-up, VDDIO and the magnetics power supply must maintain their voltage level with ±10%. Varying the volt-
age greater than ±10% after the device has completed power-up can cause errors in device operation.
5.3 Package Thermal Specifications
Note: Do not drive input signals without power supplied to the device.
TABLE 5-1: PACKAGE THERMAL PARAMETERS
Parameter Symbol Value Unit Comment
Thermal Resistance Θ
JA
47.8
o
C/W Measured in still air from the die to ambient air
Junction-to-Top-of-Package Ψ
JT
0.7
o
C/W Measured in still air
Note: Thermal parameters are measured or estimated for devices in a multi-layer 2S2P PCB per JESD51.