Datasheet

LAN8710A/LAN8710AI
DS00002164B-page 68  2016 Microchip Technology Inc.
6.0 PACKAGE INFORMATION
6.1 32-QFN (Punch)
FIGURE 6-1: 32-QFN PACKAGE
TABLE 6-1: 32-QFN DIMENSIONS
Min Nominal Max Remarks
A 0.70 0.85 1.00 Overall Package Height
A1 0 0.02 0.05 Standoff
A2 — 0.65 0.90 Mold Cap Thickness
D/E 4.90 5.00 5.10 X/Y Body Size
D1/E1 4.55 4.75 4.95 X/Y Mold Cap Size
D2/E2 3.20 3.30 3.40 X/Y Exposed Pad Size
L 0.30 0.40 0.50 Terminal Length
b 0.18 0.25 0.30 Terminal Width
k 0.35 0.45 — Terminal to Exposed Pad Clearance
e 0.50 BSC Terminal Pitch
Note 1: All dime
nsions are in millimeters unless otherwise noted.
2: Dimen
sion “b” applies to plated terminals and is measured between 0.15 and 0.30 mm from the terminal tip.
3: Th
e pin 1 identifier may vary, but is always located within the zone indicated.