Datasheet

LAN8700/LAN8700i
DS00002260A-page 58  2007-2016 Microchip Technology Inc.
7.0 DC ELECTRICAL CHARACTERISTICS
7.1 DC Characteristics
7.1.1 MAXIMUM RATINGS
Stresses beyond those listed in may cause permanent damage to the device. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
7.1.1.1 Human Body Model (HBM) Performance
HBM testing verifies the ability to withstand the ESD strikes like those that occur during handling and manufacturing,
and is done without power applied to the IC. To pass the test, the device must have no change in operation or perfor-
mance due to the event. All pins on the LAN8700 provide ±8kV HBM protection.
7.1.1.2 IEN/IEC61000-4-2 Performance
The EN/IEC61000-4-2 ESD specification is an international standard that addresses system-level immunity to ESD
strikes while the end equipment is operational. In contrast, the HBM ESD tests are performed at the device level with
the device powered down.
Microchip contracts with Independent laboratories to test the LAN8700 to EN/IEC61000-4-2 in a working system.
Reports are available upon request. Please contact your Microchip representative, and request information on 3rd party
ESD test results. The reports show that systems designed with the LAN8700 can safely dissipate ±15kV air discharges
and ±8kV contact discharges per the EN/IEC61000-4-2 specification without additional board level protection.
In addition to defining the ESD tests, EN/IEC61000-4-2 also categorizes the impact to equipment operation when the
strike occurs (ESD Result Classification). The LAN8700 maintains an ESD Result Classification 1 or 2 when subjected
to an EN/IEC61000-4-2 (level 4) ESD strike.
Both air discharge and contact discharge test techniques for applying stress conditions are defined by the
EN/IEC61000-4-2 ESD document.
TABLE 7-1: MAXIMUM CONDITIONS
Parameter Conditions MIN TYP MAX Units Comment
VDD33,VDDIO Power pins to all other pins. -0.5 +3.6 V
Digital IO To VSS ground -0.5 +3.6 V Table 7-5, “MII Bus
Interface Signals,” on
page 60
VSS VSS to all other pins -0.5 +4.0 V
Operating
Temperature
LAN8700-AEZG 0 +70 C Commercial temperature
components.
Operating
Temperature
LAN8700i-AEZG -40 +85 C Industrial temperature
components.
Storage
Temperature
-55 +150 C
TABLE 7-2: ESD AND LATCH-UP PERFORMANCE
Parameter Conditions MIN TYP MAX Units Comments
ESD PERFORMANCE
All Pins Human Body Model ±8 kV Device
System EN/IEC61000-4-2 Contact
Discharge
±8 kV 3rd party system test
System EN/IEC61000-4-2 Air-gap
Discharge
±15 kV 3rd party system test
LATCH-UP PERFORMANCE
All Pins EIA/JESD 78, Class II 150 mA