Datasheet

KSZ9031RNX
DS00002117F-page 70  2016-2017 Microchip Technology Inc.
FIGURE 13-2: 48-LEAD QFN 7 MM X 7 MM PACKAGE WITH 5.1 MM X 5.1 MM EXPOSED PAD
AREA
TITLE
48 LEAD QFN 7x7mm PACKAGE OUTLINE & RECOMMENDED LAND PATTERN
DRAWING #
QFN77-48LD-PL-1
UNIT
MM
NOTE:
1. MAX PACKAGE WARPAGE IS 0.05mm.
2. MAX ALLOWABLE BURR IS 0.076mm IN ALL DIRECTIONS.
3. PIN #1 IS ON TOP WILL BE LASER MARKED.
4. RED CIRCLE IN LAND PATTERN INDICATES THERMAL VIA. SIZE SHOULD BE 0.30-0.35mm IN DIAMETER AND SHOULD BE
CONNECTED TO GND FOR MAX THERMAL PERFORMANCE. PITCH is 1.00mm.
5. GREEN RECTANGLES (SHADED AREA) REPRESENT SOLDER STENCIL OPENING ON EXPOSED PAD AREA. RECOMMENDED SIZE
IS 1.00x1.00mm, SPACING IS 0.25mm.
NOTE: 1, 2, 3
0.25±0.05
5.50
Ref.
0.50 Bsc
0.40±0.05
PIN #1 ID
CHAMFER 0.35x45°
48
1
2
7.00±0.05
7.00±0.05
Top View
NOTE: 1, 2, 3
Bottom View
0.85±0.05
0.253 (REF)
0.00-0.05
NOTE: 1, 2, 3
Side View
5.10±0.05
Exp.DAP
5.10±0.05
Exp.DAP