Datasheet

2016 Microchip Technology Inc. DS00002246A-page 87
KSZ8895MQX/RQX/FQX/MLX
5.0 OPERATIONAL CHARACTERISTICS
5.1 Absolute Maximum Ratings*
Supply Voltage
(V
DDAR
, V
DDAP
, V
DDC
)............................................................................................................................... –0.5V to +2.4V
(V
DDAT
, V
DDIO
) .......................................................................................................................................... –0.5V to +4.0V
Input Voltage ............................................................................................................................................. –0.5V to +4.0V
Output Voltage .......................................................................................................................................... –0.5V to +4.0V
Lead Temperature (soldering, 10s) ....................................................................................................................... +260°C
Storage Temperature (T
S
) ...................................................................................................................... –55°C to +150°C
HBM ESD Rating** .................................................................................................................................................... 5 kV
*Exceeding the absolute maximum rating may damage the device. Stresses greater than the absolute maximum rating
may cause permanent damage to the device. Operation of the device at these or any other conditions above those spec-
ified in the operating sections of this specification is not implied. Maximum conditions for extended periods may affect
reliability.
**Devices are ESD sensitive. Handling precautions are recommended. Human body model, 1.5 k in series with
100 pF.
5.2 Operating Ratings***
Supply Voltage
(V
DDAR
, V
DDC
)................................................................................................................................... +1.140V to +1.320V
(V
DDAT
).............................................................................................................................................. +3.135V to +3.465V
(V
DDIO
@ 3.3V) ................................................................................................................................. +3.135V to +3.465V
(V
DDIO
@ 2.5V) ................................................................................................................................. +2.375V to +2.625V
(V
DDIO
@ 1.8V) ................................................................................................................................. +1.710V to +1.890V
Ambient Temperature
(T
A
Commercial)........................................................................................................................................... 0°C to +70°C
(T
A
Industrial) ........................................................................................................................................... –40°C to +85°C
Maximum Junction Temperature (T
J
max.) ........................................................................................................... +125°C
128-Pin Package Thermal Resistance****
PQFP Thermal Resistance (
JA
)...................................................................................................................+41.54°C/W
PQFP Thermal Resistance (
JC
)...................................................................................................................+19.78°C/W
LQFP Thermal Resistance (
JA
) ...................................................................................................................+48.22°C/W
LQFP Thermal Resistance (
JC
) ...................................................................................................................+13.95°C/W
***The device is not guaranteed to function outside its operating ratings. Unused inputs must always be tied to an appro-
priate logic voltage level (ground or V
DD
).
****No heat spreader in package. The thermal junction to ambient (
JA
) and the thermal junction to case (
JC
) are under
air velocity 0 m/s.
Note: Do not drive input signals without power supplied to the device.