Datasheet

Micrel, Inc.
KSZ8081MNX/KSZ8081RNB
August
19, 2015 3
Revision 1.4
Revision History
Revision Date Summary of Changes
1.0 11/5/12 Initial release of datasheet.
1.1 2/6/14
Removed copper wire bonding part numbers from Ordering Information.
Added note for TXC (Pin 22) and Register 16h, Bit [15] regarding a Reserved Factory Mode for
KSZ8081MNX device.
Corrected TXC (Pin 22) pin type for KSZ8081MNX device.
Removed TXC and RXC clock connections for MII Back-to-Back mode. This is a datasheet correction.
There is no change to the silicon.
Added series resistance and load capacitance for the crystal selection criteria.
1.2 12/18/14
Added silver wire bonding part numbers to Ordering Information.
Updated Ordering Information to include Ordering Part Number and Device Marking.
1.3
04/14/15
Updated Table 7, add a note for Table 7.
Updated Table 8, updated NAND tree I/O testing descriptions.
Add Max frequency for MDC in MII Management (MIIM) Interface section.
Updated Table 23, add a note for Table 23.
Updated Figure 22 and Figure 22 descriptions.
Updated descriptions under Figure 23 for LED strap pins, add a note for Figure 23.
Fixed the missing value for maximum junction and thermal resistance (θ
JC
).
1.4 08/19/15
Updated descriptions in local loopback section for data loopback path.
Updated Table 17 and Table 21.
Updated Ordering Information Table.
Updated pin 22 TXC and register 16h bit [15] description for MNX part.
Updated description and add an equation in LinkMD section.
Add HBM ESD rating in Features.