Datasheet
Table Of Contents
- 1.0 Electrical Characteristics
- 2.0 Pin Description
- 3.0 Application Information
- 4.0 Packaging Information
- 4.1 Package Marking Information
- Corporate Office
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- Fax: 216-447-0643
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- Germany - Pforzheim
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- 4.1 Package Marking Information

HV9910C
DS20005323A-page 12 2014 Microchip Technology Inc.
FIGURE 4-2: 16-LEAD SOIC (NARROW BODY) PACKAGE OUTLINE (NG)
Notes:
1. This chamfer feature is optional. A Pin 1 identifier must be located in the index area indicated. The Pin 1 identifier
can be: a molded mark/identifier; an embedded metal marker; or a printed indicator.
Top View
Side View
View A-A
View B
A
A
Seating
Plane
16
1
Seating
Plane
Gauge
Plane
L
L1
L2
θ1
θ
View B
h
h
b
A
A2
A1
e
E
E1
D
Note 1
(Index Area
D/2 x E1/2)
Symbol A A1 A2 b D E E1 e h L L1 L2 1
Dimension
(mm)
MIN 1.35* 0.10 1.25 0.31 9.80* 5.80* 3.80*
1.27
BSC
0.25 0.40
1.04
REF
0.25
BSC
0° 5°
NOM - - - - 9.906.003.90 - - - -
MAX 1.75 0.25 1.65* 0.51 10.00* 6.20* 4.00* 0.50 1.27 8° 15°
JEDEC Registration MS-012, Variation AC, Issue E, Sep 2005.
* This dimension is not specified in the JEDEC drawing.
† This dimension differs from the JEDEC drawing.
Drawings not to scale.