Datasheet

dsPIC33EPXXXGM3XX/6XX/7XX
DS70000689D-page 530  2013-2014 Microchip Technology Inc.
PMP Pinout and Connections to
External Devices ............................................... 395
Programmer’s Model................................................... 30
PTG Module .............................................................. 350
QEIx Module ............................................................. 258
Recommended Minimum Connection ......................... 22
Remappable Input for U1RX ..................................... 166
Reset System............................................................111
RTCC Module ........................................................... 384
Shared Port Structure ...............................................163
Single-Phase Synchronous Buck Converter............... 25
SPIx Module.............................................................. 274
Suggested Oscillator Circuit Placement...................... 23
Type B Timer (Timer2/4/6/8).....................................214
Type B/Type C Timer Pair (32-Bit Timer).................. 215
Type C Timer (Timer3/5/7/9)..................................... 214
UARTx Module.......................................................... 289
User-Programmable Blanking Function .................... 367
Watchdog Timer (WDT) ............................................ 417
Brown-out Reset (BOR) .................................................... 416
C
C Compilers
MPLAB XC Compilers...............................................430
CAN Module
Control Registers ...................................................... 297
Message Buffers ....................................................... 316
Word 0 ..............................................................316
Word 1 ..............................................................316
Word 2 ..............................................................317
Word 3 ..............................................................317
Word 4 ..............................................................318
Word 5 ..............................................................318
Word 6 ..............................................................319
Word 7 ..............................................................319
Modes of Operation .................................................. 296
Overview ...................................................................295
CAN Module (CAN)........................................................... 295
Charge Time Measurement Unit (CTMU) ......................... 321
Code Examples
IC1 Connection to HOME1 QEI1 Digital
Filter Input on Pin 43......................................... 166
PORTB Write/Read................................................... 164
PWM1 Write-Protected Register
Unlock Sequence.............................................. 230
PWRSAV Instruction Syntax..................................... 153
Code Protection ........................................................ 411, 418
CodeGuard Security.................................................. 411, 418
Configuration Bits.............................................................. 411
Description ................................................................ 413
CPU..................................................................................... 27
Addressing Modes ...................................................... 27
Arithmetic Logic Unit (ALU).........................................35
Control Registers ........................................................ 31
Data Space Addressing .............................................. 27
DSP Engine ................................................................35
Instruction Set ............................................................. 27
Programmer’s Model................................................... 29
Register Descriptions.......................................... 29
CTMU
Control Registers ...................................................... 323
Customer Change Notification Service ............................. 536
Customer Notification Service........................................... 536
Customer Support ............................................................. 536
D
Data Address Space........................................................... 41
Memory Map for 128-Kbyte Devices .......................... 42
Memory Map for 256-Kbyte Devices .......................... 43
Memory Map for 512-Kbyte Devices .......................... 44
Near Data Space ........................................................ 41
Organization and Alignment ....................................... 41
SFR Space ................................................................. 41
Width .......................................................................... 41
Data Converter Interface (DCI) Module ............................ 343
Data Memory
Arbitration and Bus Master Priority............................. 95
DC Characteristics............................................................ 434
Brown-out Reset (BOR)............................................ 443
CTMU Current Source.............................................. 490
Doze Current (I
DOZE)........................................ 439, 501
Filter Capacitor (C
EFC) Specifications ...................... 435
High Temperature..................................................... 500
I/O Pin Input Specifications....................................... 440
I/O Pin Output Specifications............................ 443, 502
Idle Current (I
IDLE) ............................................ 437, 501
Op Amp/Comparator Specifications ......................... 488
Op Amp/Comparator Voltage
Reference Specifications .................................. 489
Operating Current (I
DD) .................................... 436, 501
Operating MIPS vs. Voltage ............................. 434, 500
Power-Down Current (I
PD)................................ 438, 500
Program Memory.............................................. 444, 502
Temperature and Voltage ......................................... 500
Temperature and Voltage Specifications.................. 435
Thermal Operating Conditions.......................... 434, 500
Thermal Packaging Characteristics.......................... 434
DCI
Control Registers ...................................................... 344
Introduction............................................................... 343
Demo/Development Boards, Evaluation
and Starter Kits ......................................................... 432
Development Support ....................................................... 429
Third-Party Tools ...................................................... 432
DMA Controller
Channel to Peripheral Associations.......................... 130
Control Registers ...................................................... 132
DMAxCNT ........................................................ 132
DMAxCON........................................................ 132
DMAxPAD ........................................................ 132
DMAxREQ........................................................ 132
DMAxSTAL/H ................................................... 132
DMAxSTBL/H ................................................... 132
Supported Peripherals.............................................. 129
Doze Mode ....................................................................... 155
E
Electrical Characteristics .................................................. 433
AC..................................................................... 445, 503
Equations
Device Operating Frequency .................................... 144
F
OSC Calculation ...................................................... 144
F
VCO Calculation ...................................................... 144
Errata .................................................................................. 12