Datasheet

 2013-2014 Microchip Technology Inc. DS70000689D-page 527
dsPIC33EPXXXGM3XX/6XX/7XX
APPENDIX A: REVISION HISTORY
Revision A (February 2013)
This is the initial released version of this document.
Revision B (June 2013)
Changes to Section 5.0 “Flash Program Memory”,
Register 5-1. Changes to Section 6.0 “Resets”,
Figure 6-1. Changes to Section 26.0 “Op Amp/Com-
parator Module”, Register 26-2. Updates to most of the
tables in Section 33.0 “Electrical Characteristics”.
Minor text edits throughout the document.
Revision C (September 2013)
Changes to Figure 23-1. Changes to Figure 26-2.
Changes to Table 30-2. Changes to Section 33.0
“Electrical Characteristics”. Added Section 34.0
“High-Temperature Electrical Characteristics” to the
data sheet. Minor typographical edits throughout the
document.
Revision D (August 2014)
This revision incorporates the following updates:
• Sections:
- Updated Section 2.0 “Guidelines for Getting
Started with 16-Bit Digital Signal Control-
lers”, Section 8.0 “Direct Memory Access
(DMA)”, Section 10.3 “Doze Mode”,
Section 21.0 “Controller Area Network
(CAN) Module (dsPIC33EPXXXGM6XX/7XX
Devices Only)”, Section 23.0 “10-Bit/12-Bit
Analog-to-Digital Converter (ADC)”,
Section 23.1.2 “12-Bit ADCx Configuration”,
Section 21.4 “CAN Message Buffers”,
Section 35.0 “Packaging Information”
•Figures:
- Updated “Pin Diagrams”, Figure 1-1,
Figure 9-1
•Registers:
- Updated Register 5-1, Register 8-2,
Register 21-1, Register 23-2
• Tables:
- Updated Ta bl e 1- 1 , Tab le 7- 1, Tab le 8- 1,
Table 34-9, Tabl e 1, Tabl e 4- 2, Table 4-3,
Table 4-25, Tabl e 4- 33 , Tabl e 4- 34,
Table 4-39, Tabl e 4- 30 , Tabl e 4- 46,
Table 4-47, Table 33-16,Tabl e 34- 8