Datasheet

 2013-2014 Microchip Technology Inc. DS70000689D-page 525
dsPIC33EPXXXGM3XX/6XX/7XX
Microchip Technology Drawing C04-148 Rev F Sheet 2 of 2
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
121-Ball Plastic Thin Profile Fine Pitch Ball Grid Array (BG) -
Dimension Limits
Units
D
Overall Width
Overall Length
Array Length
Array Width
D1
E1
E
MILLIMETERS
MIN
MAX
10.00 BSC
Contact Diameter
b
Notes:
1.
NOM
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
2.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Ball Height A1
Overall Height A
Contact Pitch
e
0.80 BSC
Number of Contacts N 121
0.25
0.40
10.00 BSC
1.20
8.00 BSC
8.00 BSC
3.
1.101.00
0.30 0.35
NX Øb
0.15 C A B
0.08 C
C
0.10
C
DETAIL A
DETAIL B
0.35 0.45
4. Ball interface to package body: 0.37mm nominal diameter.
Ball A1 visual index feature may vary, but must be located within the hatched area.
Dimensioning and tolerancing per ASME Y14.5M.
The outer rows and colums of balls are located with respect to datums A and B.
10x10x1.10 mm Body [TFBGA]