Datasheet

dsPIC33EPXXXGM3XX/6XX/7XX
DS70000689D-page 518  2013-2014 Microchip Technology Inc.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
64-Lead Plastic Thin Quad Flatpack (PT)-10x10x1 mm Body, 2.00 mm Footprint [TQFP]
13°12°11°
E
Mold Draft Angle Bottom
13°12°11°
D
Mold Draft Angle Top
0.270.220.17
b
Lead Width
0.20-0.09
c
Lead Thickness
10.00 BSC
D1
Molded Package Length
10.00 BSCE1Molded Package Width
12.00 BSCDOverall Length
12.00 BSCEOverall Width
7°3.5°0°
I
Foot Angle
0.750.600.45LFoot Length
0.15-0.05A1Standoff
1.051.000.95A2Molded Package Thickness
1.20--AOverall Height
0.50 BSC
e
Lead Pitch
64NNumber of Leads
MAXNOMMINDimension Limits
MILLIMETERSUnits
Footprint
L1
1.00 REF
2. Chamfers at corners are optional; size may vary.
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed 0.25mm per side.
Notes:
Microchip Technology Drawing C04-085C Sheet 2 of 2
L
(L1)
E
c
H
X
X=A—B OR D
e/2
DETAIL 1
SECTION A-A
T