Datasheet

dsPIC33EPXXXGM3XX/6XX/7XX
DS70000689D-page 434  2013-2014 Microchip Technology Inc.
33.1 DC Characteristics
TABLE 33-1: OPERATING MIPS vs. VOLTAGE
Characteristic
V
DD Range
(in Volts)
Temperature Range
(in °C)
Maximum MIPS
dsPIC33EPXXXGM3XX/6XX/7XX
I-Temp 3.0V to 3.6V
(1)
-40°C to +85°C 70
E-Temp 3.0V to 3.6V
(1)
-40°C to +125°C 60
Note 1: Device is functional at V
BORMIN < VDD < VDDMIN. Analog modules: ADC, op amp/comparator and
comparator voltage reference will have degraded performance. Device functionality is tested but not
characterized. Refer to Parameter BO10 in Table 33-12 for the minimum and maximum BOR values.
TABLE 33-2: THERMAL OPERATING CONDITIONS
Rating Symbol Min. Typ. Max. Unit
Industrial Temperature Devices:
Operating Junction Temperature Range TJ -40 — +125 °C
Operating Ambient Temperature Range TA -40 — +85 °C
Extended Temperature Devices:
Operating Junction Temperature Range T
J -40 — +140 °C
Operating Ambient Temperature Range TA -40 — +125 °C
Power Dissipation:
Internal Chip Power Dissipation:
P
INT = VDD x (IDD –  IOH)
PD PINT + PI/O W
I/O Pin Power Dissipation:
I/O =  ({V
DD – VOH} x IOH) +  (VOL x IOL)
Maximum Allowed Power Dissipation PDMAX (TJ – TA)/JA W
TABLE 33-3: THERMAL PACKAGING CHARACTERISTICS
Characteristic Symbol Typ. Max. Unit Notes
Package Thermal Resistance, 121-Pin BGA 
JA 40 — °C/W 1
Package Thermal Resistance, 100-Pin TQFP 12x12 mm JA 43 — °C/W 1
Package Thermal Resistance, 100-Pin TQFP 14x14 mm 
JA —°C/W 1
Package Thermal Resistance, 64-Pin QFN JA 28.0 — °C/W 1
Package Thermal Resistance, 64-Pin TQFP 10x10 mm 
JA 48.3 — °C/W 1
Package Thermal Resistance, 44-Pin QFN 
JA 29.0 — °C/W 1
Package Thermal Resistance, 44-Pin TQFP 10x10 mm JA 49.8 — °C/W 1
Package Thermal Resistance, 44-Pin VTLA 6x6 mm 
JA 25.2 — °C/W 1
Package Thermal Resistance, 36-Pin VTLA 5x5 mm 
JA 28.5 — °C/W 1
Package Thermal Resistance, 28-Pin QFN-S JA 30.0 — °C/W 1
Package Thermal Resistance, 28-Pin SSOP 
JA 71.0 — °C/W 1
Package Thermal Resistance, 28-Pin SOIC 
JA 69.7 — °C/W 1
Package Thermal Resistance, 28-Pin SPDIP JA 60.0 — °C/W 1
Note 1: Junction to ambient thermal resistance, Theta-
JA (JA) numbers are achieved by package simulations.