Datasheet
Table Of Contents
- Features
- 1. Ordering Information
- 2. Pinout/Block Diagram
- 3. Overview
- 4. Resources
- 5. Capacitive touch sensing
- 6. AVR CPU
- 7. Memories
- 8. DMAC – Direct Memory Access Controller
- 9. Event System
- 10. System Clock and Clock options
- 10.1 Features
- 10.2 Overview
- 10.3 Clock Sources
- 10.3.1 32kHz Ultra Low Power Internal Oscillator
- 10.3.2 32.768kHz Calibrated Internal Oscillator
- 10.3.3 32.768kHz Crystal Oscillator
- 10.3.4 0.4 - 16MHz Crystal Oscillator
- 10.3.5 2MHz Run-time Calibrated Internal Oscillator
- 10.3.6 32MHz Run-time Calibrated Internal Oscillator
- 10.3.7 External Clock Sources
- 10.3.8 PLL with 1x-31x Multiplication Factor
- 11. Power Management and Sleep Modes
- 12. System Control and Reset
- 13. WDT – Watchdog Timer
- 14. Interrupts and Programmable Multilevel Interrupt Controller
- 15. I/O Ports
- 16. TC0/1 – 16-bit Timer/Counter Type 0 and 1
- 17. TC2 - Timer/Counter Type 2
- 18. AWeX – Advanced Waveform Extension
- 19. Hi-Res – High Resolution Extension
- 20. RTC – 16-bit Real-Time Counter
- 21. USB – Universal Serial Bus Interface
- 22. TWI – Two-Wire Interface
- 23. SPI – Serial Peripheral Interface
- 24. USART
- 25. IRCOM – IR Communication Module
- 26. AES and DES Crypto Engine
- 27. CRC – Cyclic Redundancy Check Generator
- 28. ADC – 12-bit Analog to Digital Converter
- 29. DAC – 12-bit Digital to Analog Converter
- 30. AC – Analog Comparator
- 31. Programming and Debugging
- 32. Pinout and Pin Functions
- 33. Peripheral Module Address Map
- 34. Instruction Set Summary
- 35. Packaging information
- 36. Electrical Characteristics
- 36.1 ATxmega16A4U
- 36.1.1 Absolute Maximum Ratings
- 36.1.2 General Operating Ratings
- 36.1.3 Current consumption
- 36.1.4 Wake-up time from sleep modes
- 36.1.5 I/O Pin Characteristics
- 36.1.6 ADC characteristics
- 36.1.7 DAC Characteristics
- 36.1.8 Analog Comparator Characteristics
- 36.1.9 Bandgap and Internal 1.0V Reference Characteristics
- 36.1.10 Brownout Detection Characteristics
- 36.1.11 External Reset Characteristics
- 36.1.12 Power-on Reset Characteristics
- 36.1.13 Flash and EEPROM Memory Characteristics
- 36.1.14 Clock and Oscillator Characteristics
- 36.1.14.1 Calibrated 32.768kHz Internal Oscillator characteristics
- 36.1.14.2 Calibrated 2MHz RC Internal Oscillator characteristics
- 36.1.14.3 Calibrated and tunable 32MHz internal oscillator characteristics
- 36.1.14.4 32kHz Internal ULP Oscillator characteristics
- 36.1.14.5 Internal Phase Locked Loop (PLL) characteristics
- 36.1.14.6 External clock characteristics
- 36.1.14.7 External 16MHz crystal oscillator and XOSC characteristic
- 36.1.14.8 External 32.768kHz crystal oscillator and TOSC characteristics
- 36.1.15 SPI Characteristics
- 36.1.16 Two-Wire Interface Characteristics
- 36.2 ATxmega32A4U
- 36.2.1 Absolute Maximum Ratings
- 36.2.2 General Operating Ratings
- 36.2.3 Current consumption
- 36.2.4 Wake-up time from sleep modes
- 36.2.5 I/O Pin Characteristics
- 36.2.6 ADC characteristics
- 36.2.7 DAC Characteristics
- 36.2.8 Analog Comparator Characteristics
- 36.2.9 Bandgap and Internal 1.0V Reference Characteristics
- 36.2.10 Brownout Detection Characteristics
- 36.2.11 External Reset Characteristics
- 36.2.12 Power-on Reset Characteristics
- 36.2.13 Flash and EEPROM Memory Characteristics
- 36.2.14 Clock and Oscillator Characteristics
- 36.2.14.1 Calibrated 32.768kHz Internal Oscillator characteristics
- 36.2.14.2 Calibrated 2MHz RC Internal Oscillator characteristics
- 36.2.14.3 Calibrated and tunable 32MHz internal oscillator characteristics
- 36.2.14.4 32kHz Internal ULP Oscillator characteristics
- 36.2.14.5 Internal Phase Locked Loop (PLL) characteristics
- 36.2.14.6 External clock characteristics
- 36.2.14.7 External 16MHz crystal oscillator and XOSC characteristic
- 36.2.14.8 External 32.768kHz crystal oscillator and TOSC characteristics
- 36.2.15 SPI Characteristics
- 36.2.16 Two-Wire Interface Characteristics
- 36.3 ATxmega64A4U
- 36.3.1 Absolute Maximum Ratings
- 36.3.2 General Operating Ratings
- 36.3.3 Current consumption
- 36.3.4 Wake-up time from sleep modes
- 36.3.5 I/O Pin Characteristics
- 36.3.6 ADC characteristics
- 36.3.7 DAC Characteristics
- 36.3.8 Analog Comparator Characteristics
- 36.3.9 Bandgap and Internal 1.0V Reference Characteristics
- 36.3.10 Brownout Detection Characteristics
- 36.3.11 External Reset Characteristics
- 36.3.12 Power-on Reset Characteristics
- 36.3.13 Flash and EEPROM Memory Characteristics
- 36.3.14 Clock and Oscillator Characteristics
- 36.3.14.1 Calibrated 32.768kHz Internal Oscillator characteristics
- 36.3.14.2 Calibrated 2MHz RC Internal Oscillator characteristics
- 36.3.14.3 Calibrated and tunable 32MHz internal oscillator characteristics
- 36.3.14.4 32kHz Internal ULP Oscillator characteristics
- 36.3.14.5 Internal Phase Locked Loop (PLL) characteristics
- 36.3.14.6 External clock characteristics
- 36.3.14.7 External 16MHz crystal oscillator and XOSC characteristic
- 36.3.14.8 External 32.768kHz crystal oscillator and TOSC characteristics
- 36.3.15 SPI Characteristics
- 36.3.16 Two-Wire Interface Characteristics
- 36.4 ATxmega128A4U
- 36.4.1 Absolute Maximum Ratings
- 36.4.2 General Operating Ratings
- 36.4.3 Current consumption
- 36.4.4 Wake-up time from sleep modes
- 36.4.5 I/O Pin Characteristics
- 36.4.6 ADC characteristics
- 36.4.7 DAC Characteristics
- 36.4.8 Analog Comparator Characteristics
- 36.4.9 Bandgap and Internal 1.0V Reference Characteristics
- 36.4.10 Brownout Detection Characteristics
- 36.4.11 External Reset Characteristics
- 36.4.12 Power-on Reset Characteristics
- 36.4.13 Flash and EEPROM Memory Characteristics
- 36.4.14 Clock and Oscillator Characteristics
- 36.4.14.1 Calibrated 32.768kHz Internal Oscillator characteristics
- 36.4.14.2 Calibrated 2MHz RC Internal Oscillator characteristics
- 36.4.14.3 Calibrated and tunable 32MHz internal oscillator characteristics
- 36.4.14.4 32kHz Internal ULP Oscillator characteristics
- 36.4.14.5 Internal Phase Locked Loop (PLL) characteristics
- 36.4.14.6 External clock characteristics
- 36.4.14.7 External 16MHz crystal oscillator and XOSC characteristic
- 36.4.14.8 External 32.768kHz crystal oscillator and TOSC characteristics
- 36.4.15 SPI Characteristics
- 36.4.16 Two-Wire Interface Characteristics
- 36.1 ATxmega16A4U
- 37. Typical Characteristics
- 37.1 ATxmega16A4U
- 37.1.1 Current consumption
- 37.1.2 I/O Pin Characteristics
- 37.1.3 ADC Characteristics
- 37.1.4 DAC Characteristics
- 37.1.5 Analog Comparator Characteristics
- 37.1.6 Internal 1.0V reference Characteristics
- 37.1.7 BOD Characteristics
- 37.1.8 External Reset Characteristics
- 37.1.9 Power-on Reset Characteristics
- 37.1.10 Oscillator Characteristics
- 37.1.11 Two-Wire Interface characteristics
- 37.1.12 PDI characteristics
- 37.2 ATxmega32A4U
- 37.2.1 Current consumption
- 37.2.2 I/O Pin Characteristics
- 37.2.3 ADC Characteristics
- 37.2.4 DAC Characteristics
- 37.2.5 Analog Comparator Characteristics
- 37.2.6 Internal 1.0V reference Characteristics
- 37.2.7 BOD Characteristics
- 37.2.8 External Reset Characteristics
- 37.2.9 Power-on Reset Characteristics
- 37.2.10 Oscillator Characteristics
- 37.2.11 Two-Wire Interface characteristics
- 37.2.12 PDI characteristics
- 37.3 ATxmega64A4U
- 37.3.1 Current consumption
- 37.3.2 I/O Pin Characteristics
- 37.3.3 ADC Characteristics
- 37.3.4 DAC Characteristics
- 37.3.5 Analog Comparator Characteristics
- 37.3.6 Internal 1.0V reference Characteristics
- 37.3.7 BOD Characteristics
- 37.3.8 External Reset Characteristics
- 37.3.9 Power-on Reset Characteristics
- 37.3.10 Oscillator Characteristics
- 37.3.11 Two-Wire Interface characteristics
- 37.3.12 PDI characteristics
- 37.4 ATxmega128A4U
- 37.4.1 Current consumption
- 37.4.2 I/O Pin Characteristics
- 37.4.3 ADC Characteristics
- 37.4.4 DAC Characteristics
- 37.4.5 Analog Comparator Characteristics
- 37.4.6 Internal 1.0V reference Characteristics
- 37.4.7 BOD Characteristics
- 37.4.8 External Reset Characteristics
- 37.4.9 Power-on Reset Characteristics
- 37.4.10 Oscillator Characteristics
- 37.4.11 Two-Wire Interface characteristics
- 37.4.12 PDI characteristics
- 37.1 ATxmega16A4U
- 38. Errata
- 39. Datasheet Revision History
- Table of Contents
24
XMEGA A4U [DATASHEET]
Atmel-8387H-AVR-ATxmega16A4U-34A4U-64A4U-128A4U-Datasheet_09/2014
11. Power Management and Sleep Modes
11.1 Features
z Power management for adjusting power consumption and functions
z Five sleep modes
z Idle
z Power down
z Power save
z Standby
z Extended standby
z Power reduction register to disable clock and turn off unused peripherals in active and idle modes
11.2 Overview
Various sleep modes and clock gating are provided in order to tailor power consumption to application requirements.
This enables the Atmel AVR XMEGA microcontroller to stop unused modules to save power.
All sleep modes are available and can be entered from active mode. In active mode, the CPU is executing application
code. When the device enters sleep mode, program execution is stopped and interrupts or a reset is used to wake the
device again. The application code decides which sleep mode to enter and when. Interrupts from enabled peripherals
and all enabled reset sources can restore the microcontroller from sleep to active mode.
In addition, power reduction registers provide a method to stop the clock to individual peripherals from software. When
this is done, the current state of the peripheral is frozen, and there is no power consumption from that peripheral. This
reduces the power consumption in active mode and idle sleep modes and enables much more fine-tuned power
management than sleep modes alone.
11.3 Sleep Modes
Sleep modes are used to shut down modules and clock domains in the microcontroller in order to save power.
XMEGA microcontrollers have five different sleep modes tuned to match the typical functional stages during
application execution. A dedicated sleep instruction (SLEEP) is available to enter sleep mode. Interrupts are used to
wake the device from sleep, and the available interrupt wake-up sources are dependent on the configured sleep
mode. When an enabled interrupt occurs, the device will wake up and execute the interrupt service routine before
continuing normal program execution from the first instruction after the SLEEP instruction. If other, higher priority
interrupts are pending when the wake-up occurs, their interrupt service routines will be executed according to their
priority before the interrupt service routine for the wake-up interrupt is executed. After wake-up, the CPU is halted for
four cycles before execution starts.
The content of the register file, SRAM and registers are kept during sleep. If a reset occurs during sleep, the device
will reset, start up, and execute from the reset vector.
11.3.1 Idle Mode
In idle mode the CPU and nonvolatile memory are stopped (note that any ongoing programming will be completed),
but all peripherals, including the interrupt controller, event system and DMA controller are kept running. Any enabled
interrupt will wake the device.
11.3.2 Power-down Mode
In power-down mode, all clocks, including the real-time counter clock source, are stopped. This allows operation only
of asynchronous modules that do not require a running clock. The only interrupts that can wake up the MCU are the
two-wire interface address match interrupt, asynchronous port interrupts, and the USB resume interrupt.