Datasheet
Table Of Contents
- Features
- 1. Ordering Information
- 2. Pinout/Block Diagram
- 3. Overview
- 4. Resources
- 5. Capacitive touch sensing
- 6. AVR CPU
- 7. Memories
- 8. DMAC – Direct Memory Access Controller
- 9. Event System
- 10. System Clock and Clock options
- 10.1 Features
- 10.2 Overview
- 10.3 Clock Sources
- 10.3.1 32kHz Ultra Low Power Internal Oscillator
- 10.3.2 32.768kHz Calibrated Internal Oscillator
- 10.3.3 32.768kHz Crystal Oscillator
- 10.3.4 0.4 - 16MHz Crystal Oscillator
- 10.3.5 2MHz Run-time Calibrated Internal Oscillator
- 10.3.6 32MHz Run-time Calibrated Internal Oscillator
- 10.3.7 External Clock Sources
- 10.3.8 PLL with 1x-31x Multiplication Factor
- 11. Power Management and Sleep Modes
- 12. System Control and Reset
- 13. WDT – Watchdog Timer
- 14. Interrupts and Programmable Multilevel Interrupt Controller
- 15. I/O Ports
- 16. TC0/1 – 16-bit Timer/Counter Type 0 and 1
- 17. TC2 - Timer/Counter Type 2
- 18. AWeX – Advanced Waveform Extension
- 19. Hi-Res – High Resolution Extension
- 20. RTC – 16-bit Real-Time Counter
- 21. USB – Universal Serial Bus Interface
- 22. TWI – Two-Wire Interface
- 23. SPI – Serial Peripheral Interface
- 24. USART
- 25. IRCOM – IR Communication Module
- 26. AES and DES Crypto Engine
- 27. CRC – Cyclic Redundancy Check Generator
- 28. ADC – 12-bit Analog to Digital Converter
- 29. DAC – 12-bit Digital to Analog Converter
- 30. AC – Analog Comparator
- 31. Programming and Debugging
- 32. Pinout and Pin Functions
- 33. Peripheral Module Address Map
- 34. Instruction Set Summary
- 35. Packaging information
- 36. Electrical Characteristics
- 36.1 ATxmega16A4U
- 36.1.1 Absolute Maximum Ratings
- 36.1.2 General Operating Ratings
- 36.1.3 Current consumption
- 36.1.4 Wake-up time from sleep modes
- 36.1.5 I/O Pin Characteristics
- 36.1.6 ADC characteristics
- 36.1.7 DAC Characteristics
- 36.1.8 Analog Comparator Characteristics
- 36.1.9 Bandgap and Internal 1.0V Reference Characteristics
- 36.1.10 Brownout Detection Characteristics
- 36.1.11 External Reset Characteristics
- 36.1.12 Power-on Reset Characteristics
- 36.1.13 Flash and EEPROM Memory Characteristics
- 36.1.14 Clock and Oscillator Characteristics
- 36.1.14.1 Calibrated 32.768kHz Internal Oscillator characteristics
- 36.1.14.2 Calibrated 2MHz RC Internal Oscillator characteristics
- 36.1.14.3 Calibrated and tunable 32MHz internal oscillator characteristics
- 36.1.14.4 32kHz Internal ULP Oscillator characteristics
- 36.1.14.5 Internal Phase Locked Loop (PLL) characteristics
- 36.1.14.6 External clock characteristics
- 36.1.14.7 External 16MHz crystal oscillator and XOSC characteristic
- 36.1.14.8 External 32.768kHz crystal oscillator and TOSC characteristics
- 36.1.15 SPI Characteristics
- 36.1.16 Two-Wire Interface Characteristics
- 36.2 ATxmega32A4U
- 36.2.1 Absolute Maximum Ratings
- 36.2.2 General Operating Ratings
- 36.2.3 Current consumption
- 36.2.4 Wake-up time from sleep modes
- 36.2.5 I/O Pin Characteristics
- 36.2.6 ADC characteristics
- 36.2.7 DAC Characteristics
- 36.2.8 Analog Comparator Characteristics
- 36.2.9 Bandgap and Internal 1.0V Reference Characteristics
- 36.2.10 Brownout Detection Characteristics
- 36.2.11 External Reset Characteristics
- 36.2.12 Power-on Reset Characteristics
- 36.2.13 Flash and EEPROM Memory Characteristics
- 36.2.14 Clock and Oscillator Characteristics
- 36.2.14.1 Calibrated 32.768kHz Internal Oscillator characteristics
- 36.2.14.2 Calibrated 2MHz RC Internal Oscillator characteristics
- 36.2.14.3 Calibrated and tunable 32MHz internal oscillator characteristics
- 36.2.14.4 32kHz Internal ULP Oscillator characteristics
- 36.2.14.5 Internal Phase Locked Loop (PLL) characteristics
- 36.2.14.6 External clock characteristics
- 36.2.14.7 External 16MHz crystal oscillator and XOSC characteristic
- 36.2.14.8 External 32.768kHz crystal oscillator and TOSC characteristics
- 36.2.15 SPI Characteristics
- 36.2.16 Two-Wire Interface Characteristics
- 36.3 ATxmega64A4U
- 36.3.1 Absolute Maximum Ratings
- 36.3.2 General Operating Ratings
- 36.3.3 Current consumption
- 36.3.4 Wake-up time from sleep modes
- 36.3.5 I/O Pin Characteristics
- 36.3.6 ADC characteristics
- 36.3.7 DAC Characteristics
- 36.3.8 Analog Comparator Characteristics
- 36.3.9 Bandgap and Internal 1.0V Reference Characteristics
- 36.3.10 Brownout Detection Characteristics
- 36.3.11 External Reset Characteristics
- 36.3.12 Power-on Reset Characteristics
- 36.3.13 Flash and EEPROM Memory Characteristics
- 36.3.14 Clock and Oscillator Characteristics
- 36.3.14.1 Calibrated 32.768kHz Internal Oscillator characteristics
- 36.3.14.2 Calibrated 2MHz RC Internal Oscillator characteristics
- 36.3.14.3 Calibrated and tunable 32MHz internal oscillator characteristics
- 36.3.14.4 32kHz Internal ULP Oscillator characteristics
- 36.3.14.5 Internal Phase Locked Loop (PLL) characteristics
- 36.3.14.6 External clock characteristics
- 36.3.14.7 External 16MHz crystal oscillator and XOSC characteristic
- 36.3.14.8 External 32.768kHz crystal oscillator and TOSC characteristics
- 36.3.15 SPI Characteristics
- 36.3.16 Two-Wire Interface Characteristics
- 36.4 ATxmega128A4U
- 36.4.1 Absolute Maximum Ratings
- 36.4.2 General Operating Ratings
- 36.4.3 Current consumption
- 36.4.4 Wake-up time from sleep modes
- 36.4.5 I/O Pin Characteristics
- 36.4.6 ADC characteristics
- 36.4.7 DAC Characteristics
- 36.4.8 Analog Comparator Characteristics
- 36.4.9 Bandgap and Internal 1.0V Reference Characteristics
- 36.4.10 Brownout Detection Characteristics
- 36.4.11 External Reset Characteristics
- 36.4.12 Power-on Reset Characteristics
- 36.4.13 Flash and EEPROM Memory Characteristics
- 36.4.14 Clock and Oscillator Characteristics
- 36.4.14.1 Calibrated 32.768kHz Internal Oscillator characteristics
- 36.4.14.2 Calibrated 2MHz RC Internal Oscillator characteristics
- 36.4.14.3 Calibrated and tunable 32MHz internal oscillator characteristics
- 36.4.14.4 32kHz Internal ULP Oscillator characteristics
- 36.4.14.5 Internal Phase Locked Loop (PLL) characteristics
- 36.4.14.6 External clock characteristics
- 36.4.14.7 External 16MHz crystal oscillator and XOSC characteristic
- 36.4.14.8 External 32.768kHz crystal oscillator and TOSC characteristics
- 36.4.15 SPI Characteristics
- 36.4.16 Two-Wire Interface Characteristics
- 36.1 ATxmega16A4U
- 37. Typical Characteristics
- 37.1 ATxmega16A4U
- 37.1.1 Current consumption
- 37.1.2 I/O Pin Characteristics
- 37.1.3 ADC Characteristics
- 37.1.4 DAC Characteristics
- 37.1.5 Analog Comparator Characteristics
- 37.1.6 Internal 1.0V reference Characteristics
- 37.1.7 BOD Characteristics
- 37.1.8 External Reset Characteristics
- 37.1.9 Power-on Reset Characteristics
- 37.1.10 Oscillator Characteristics
- 37.1.11 Two-Wire Interface characteristics
- 37.1.12 PDI characteristics
- 37.2 ATxmega32A4U
- 37.2.1 Current consumption
- 37.2.2 I/O Pin Characteristics
- 37.2.3 ADC Characteristics
- 37.2.4 DAC Characteristics
- 37.2.5 Analog Comparator Characteristics
- 37.2.6 Internal 1.0V reference Characteristics
- 37.2.7 BOD Characteristics
- 37.2.8 External Reset Characteristics
- 37.2.9 Power-on Reset Characteristics
- 37.2.10 Oscillator Characteristics
- 37.2.11 Two-Wire Interface characteristics
- 37.2.12 PDI characteristics
- 37.3 ATxmega64A4U
- 37.3.1 Current consumption
- 37.3.2 I/O Pin Characteristics
- 37.3.3 ADC Characteristics
- 37.3.4 DAC Characteristics
- 37.3.5 Analog Comparator Characteristics
- 37.3.6 Internal 1.0V reference Characteristics
- 37.3.7 BOD Characteristics
- 37.3.8 External Reset Characteristics
- 37.3.9 Power-on Reset Characteristics
- 37.3.10 Oscillator Characteristics
- 37.3.11 Two-Wire Interface characteristics
- 37.3.12 PDI characteristics
- 37.4 ATxmega128A4U
- 37.4.1 Current consumption
- 37.4.2 I/O Pin Characteristics
- 37.4.3 ADC Characteristics
- 37.4.4 DAC Characteristics
- 37.4.5 Analog Comparator Characteristics
- 37.4.6 Internal 1.0V reference Characteristics
- 37.4.7 BOD Characteristics
- 37.4.8 External Reset Characteristics
- 37.4.9 Power-on Reset Characteristics
- 37.4.10 Oscillator Characteristics
- 37.4.11 Two-Wire Interface characteristics
- 37.4.12 PDI characteristics
- 37.1 ATxmega16A4U
- 38. Errata
- 39. Datasheet Revision History
- Table of Contents
13
XMEGA A4U [DATASHEET]
Atmel-8387H-AVR-ATxmega16A4U-34A4U-64A4U-128A4U-Datasheet_09/2014
7. Memories
7.1 Features
z Flash program memory
z One linear address space
z In-system programmable
z Self-programming and boot loader support
z Application section for application code
z Application table section for application code or data storage
z Boot section for application code or boot loader code
z Separate read/write protection lock bits for all sections
z Built in fast CRC check of a selectable flash program memory section
z Data memory
z One linear address space
z Single-cycle access from CPU
z SRAM
z EEPROM
z Byte and page accessible
z Optional memory mapping for direct load and store
z I/O memory
z Configuration and status registers for all peripherals and modules
z 16 bit-accessible general purpose registers for global variables or flags
z Bus arbitration
z Deterministic priority handling between CPU, DMA controller, and other bus masters
z Separate buses for SRAM, EEPROM and I/O memory
z Simultaneous bus access for CPU and DMA controller
z Production signature row memory for factory programmed data
z ID for each microcontroller device type
z Serial number for each device
z Calibration bytes for factory calibrated peripherals
z User signature row
z One flash page in size
z Can be read and written from software
z Content is kept after chip erase
7.2 Overview
The Atmel AVR architecture has two main memory spaces, the program memory and the data memory. Executable
code can reside only in the program memory, while data can be stored in the program memory and the data memory.
The data memory includes the internal SRAM, and EEPROM for nonvolatile data storage. All memory spaces are
linear and require no memory bank switching. Nonvolatile memory (NVM) spaces can be locked for further write and
read/write operations. This prevents unrestricted access to the application software.
A separate memory section contains the fuse bytes. These are used for configuring important system functions, and
can only be written by an external programmer.
The available memory size configurations are shown in
“Ordering Information” on page 2. In addition, each device has
a Flash memory signature row for calibration data, device identification, serial number etc.