Datasheet

Table of Contents
Features......................................................................................................................................................... 1
1. Configuration Summary........................................................................................................................ 14
2. Ordering Information............................................................................................................................. 16
3. Block Diagram.......................................................................................................................................17
4. Signal Description................................................................................................................................. 21
5. Automotive Quality Grade..................................................................................................................... 28
6. Package and Pinout.............................................................................................................................. 29
6.1. 144-lead Packages.....................................................................................................................29
6.2. 144-lead Package Pinout........................................................................................................... 30
6.3. 100-lead Packages.....................................................................................................................36
6.4. 100-lead Package Pinout........................................................................................................... 37
6.5. 64-lead Package........................................................................................................................ 40
6.6. 64-lead Package Pinout............................................................................................................. 40
7. Power Considerations........................................................................................................................... 44
7.1. Power Supplies.......................................................................................................................... 44
7.2. Power Constraints......................................................................................................................44
7.3. Voltage Regulator.......................................................................................................................45
7.4. Backup SRAM Power Switch..................................................................................................... 45
7.5. Active Mode................................................................................................................................46
7.6. Low-power Modes......................................................................................................................46
7.7. Wakeup Sources........................................................................................................................ 48
7.8. Fast Startup................................................................................................................................48
8. Input/Output Lines.................................................................................................................................49
8.1. General-Purpose I/O Lines.........................................................................................................49
8.2. System I/O Lines........................................................................................................................49
8.3. NRST Pin................................................................................................................................... 50
8.4. ERASE Pin.................................................................................................................................50
9. Interconnect.......................................................................................................................................... 52
10. Product Mapping................................................................................................................................... 53
11. Memories.............................................................................................................................................. 54
11.1. Embedded Memories................................................................................................................. 54
11.2. External Memories..................................................................................................................... 60
12. Event System........................................................................................................................................ 61
12.1. Embedded Characteristics......................................................................................................... 61
12.2. Real-time Event Mapping...........................................................................................................62
13. System Controller..................................................................................................................................66
13.1. System Controller and Peripherals Mapping..............................................................................66
SAM E70/S70/V70/V71 Family
© 2019 Microchip T
echnology Inc.
Datasheet
DS60001527D-page 3